Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Infineon BTS7200-4EPA BTS7200
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Infineon BTS7200-4EPA
- Type
- INFINEON
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- BTS7200-4EPA
- Electronic Component
- 1
- Package
- PG-TSDSO-14
- Type
- Switch
- Electronic Component
- Power Electronic Switch
- Electronic Component
- 0.138g
- Electronic Component
- 1
- Channel Count
- 4
- Features
- Voltage
- Electronic Component
- BM0228572146
- Resistor
- 66.5mΩ
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 3.1V~28V
- Current
- 1A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BTS7200-4EPA — 功率电子高侧开关概述
一、产品简介
BTS7200-4EPA 是英飞凌（Infineon）推出的一款四通道高侧功率开关，封装为 PG-TSDSO-14。器件支持工作电压范围 3.1V 至 28V，单通道最大连续输出电流为 1A，导通电阻仅 66.5 mΩ，适用于对开关损耗和体积有较高要求的中低功率负载控制场合。
二、主要电气与环境参数
- 通道数：4 路高侧开关
- 控制逻辑：高电平有效（输入高电平导通）
- 最大连续电流：1 A/通道
- 工作电压：3.1 V ~ 28 V
- 导通电阻（RDS(on)）：66.5 mΩ
- 工作温度范围：-40 ℃ 至 +150 ℃
三、保护与可靠性特性
器件集成多重保护机制以提高系统可靠性：
- 过热保护（OTP）：防止器件过温损坏；
- 过流保护（OCP）：在短路或过载时限制电流或关断输出；
- 过压保护（OVP）：保护内部电路免受瞬态高压影响；
- 欠压保护（UVP）：在电源电压过低时避免不可靠工作。
这些保护有助于简化外部保护电路设计，但具体触发行为与恢复方式请参照数据手册。
四、典型应用场景
- 汽车车身电子（灯光、阀门、继电器替代）
- 工业控制与传感器供电管理
- 家电和白色家电的小功率负载驱动
- 通用负载开关与电源分配模块
五、热管理与布局建议
尽管 RDS(on) 低带来较小导通损耗（例如 1A 时约 66.5 mW），在多通道同时工作或脉冲负载场景下仍需注意散热。建议：
- 在 PCB 上使用足够的铜箔面积和散热填充层，优先连接热垫或散热焊盘；
- 在电源输入侧并联旁路电容以抑制瞬态；
- 布局时尽量缩短功率回路走线以降低寄生电阻与电感。
六、总结
BTS7200-4EPA 以其紧凑封装、低导通阻抗和完善的保护功能，适合在 3.1–28V 电源范围内实现可靠的高侧开关控制。对于需同时兼顾成本、体积与可靠性的中低功率负载管理应用，该器件是一个值得优先考虑的解决方案。欲获取引脚定义、时序与具体保护阈值，请参考英飞凌官方数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
