WMSIC Electronic Components

Infineon IPN80R900P7ATMA1

ModelIPN80R900P7ATMA1
PackageSOT-223
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IPN80R900P7ATMA1
Type
INFINEON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IPN80R900P7ATMA1
Electronic Component
1
Package
SOT-223
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.183g
Electronic Component
1
Electronic Component
BM0058404587
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
7W
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IPN80R900P7ATMA1 产品概述

一、概述

IPN80R900P7ATMA1 是英飞凌(Infineon)推出的一款高压单通道 N 沟道场效应管(MOSFET),适用于高压开关应用。该器件额定漏源电压为 800V,工作温度范围宽(-55℃ ~ +150℃),在 SOT-223 封装下提供单个器件,功耗额定为 7W,适合对体积和成本敏感且需要高耐压的电源设计。

二、主要参数

  • 类型:N 沟道 MOSFET(单个)
  • 漏源电压 Vdss:800V
  • 连续漏极电流 Id:6A
  • 导通电阻 RDS(on):900 mΩ @ Vgs=10V,Id=2.2A
  • 栅极阈值 Vgs(th):3V @ Ig=0.11mA
  • 总栅极电荷 Qg:15 nC @ Vgs=10V
  • 输入电容 Ciss:350 pF;输出电容 Coss:6 pF
  • 耗散功率 Pd:7W
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:SOT-223

三、特性与性能解读

  • 高耐压:800V 额定使其适合离线电源、反激/正激型开关电源主开关或高压开关应用。
  • 中等导通电阻:900 mΩ 在 10V 驱动下对低电流应用(几百 mA 到几安)较为合适;在高电流条件下会产生明显导通损耗,需关注热设计。
  • 栅极驱动与开关性能:Qg≈15 nC、Ciss≈350 pF,说明需要中等驱动能力的驱动器/驱动电流;对于高频应用需评估切换损耗与驱动功耗。Coss=6 pF 有利于减小开关瞬态能量。
  • 封装与热限制:SOT-223 封装利于成本和 PCB 安装,但热阻较大,器件 Pd=7W 需靠 PCB 散热或外部散热措施保证稳态工况。

四、典型应用场景

  • 离线开关电源(SMPS)主开关(如反激、半桥)
  • PFC / 高压直流转换器中高压开关元件
  • LED 驱动、电子镇流器及小功率高压逆变器
  • 高压开关控制、电源保护电路与功率整流器件替代方案

五、封装与热管理建议

  • 在 SOT-223 上实现接近额定 Pd 需良好 PCB 散热:扩大铜箔面积、使用多层过孔连接散热层。
  • 设计时考虑在高环境温度下进行功率降额;关注器件结温(Tj)限值,必要时加装散热片或降低占空比。
  • 建议在布局上缩短栅极与漏极回路的环路面积,减小寄生电感。

六、选型与使用要点

  • 确保驱动电压达到 10V 可获得标称 RDS(on);若驱动受限(例如 5V 驱动),需重新评估 RDS(on) 与损耗。
  • 在高速切换时加入合适的栅极电阻以抑制振荡,并在关键节点使用 RC 或 RCD 缓冲/吸收策略保护器件。
  • 参照英飞凌完整数据手册确认最大 Vgs、脉冲能力、SOA 及包络特性,避免超出器件极限工况。

七、总结

IPN80R900P7ATMA1 是一颗面向高压场景、封装紧凑的 N 沟道 MOSFET,具备 800V 的耐压规格和中等导通阻值,适合反激电源、LED 驱动等高压但中等功率的应用。合理的驱动、良好的 PCB 散热与保护电路设计是发挥其性能并确保可靠性的关键。若需在特定频率或更高电流工况下使用,建议结合器件详尽数据手册与热仿真进行验证。

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