WMSIC Electronic Components

Infineon BFP840FESDH6327XTSA1

ModelBFP840FESDH6327XTSA1
PackageTSFP-4
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon BFP840FESDH6327XTSA1
Type
INFINEON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BFP840FESDH6327XTSA1
Electronic Component
1
Package
TSFP-4
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.105g
Electronic Component
1
Electronic Component
BM0000530919
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
85GHz
Power Dissipation(Pd)
75mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BFP840FESDH6327XTSA1

BFP840FESDH6327XTSA1 是英飞凌(Infineon)公司推出的一款高性能 NPN 型三极管,采用 TSFP-4-1 表面贴装封装,广泛应用于高频通信和无线设备。作为一款设计用于低噪声和高线性度的三极管,BFP840 在频率响应、增益和噪声系数等多个关键性能指标上表现优异,满足现代电子设备对性能的苛刻要求。

技术参数

  1. 安装类型和封装: BFP840FESDH6327XTSA1 采用表面贴装型(SMD)设计,这一特性使得它在现代电路板设计中的安装更加便捷,适用于自动化生产线。封装为 TSFP-4-1,尺寸紧凑,便于节省电路板空间,同时保证了散热性能。

  2. 电流和功率性能: 此款三极管的最大集电极电流(Ic)为 35mA,最大功率为 75mW,这使得它在承受高负载的情况下仍能稳定工作。与此相应的,集电极-发射极击穿电压(Vce)最大值为 2.6V,确保其在电路设计时能够处理较低电压下的高电流应用。

  3. 频率特性: BFP840FESDH6327XTSA1 的跃迁频率高达 85GHz,显示了其在高频率应用中的优势。该特性使其非常适合用于需要快速信号切换和高带宽的应用,如射频放大器和毫米波信号处理。

  4. 增益和噪声性能: 增益(S21)达到 35dB,能够在增益对电路设计至关重要的情况下,提供卓越的信号放大能力。此外,在 5.5GHz 的操作频率下,噪声系数为 0.75dB,显示了出色的低噪声特性,使其非常适合于低噪声放大器(LNA)设计。这一特性对于现代通信系统中的信号接收部分显得尤为重要,能够有效提升信号质量。

  5. 工作温度和可靠性: 该三极管的工作温度最高可达 150°C(TJ),使其在极端环境条件下仍能保持良好的工作性能。这一点对于航天、汽车及工业应用尤为重要,能够确保设备在苛刻的工作环境中持续、稳定的运行。

  6. 直流电流增益: 在特定条件下(Ic = 10mA,Vce = 1.8V),BFP840的 DC 电流增益(hFE)最低值为 150。这一高增益特性使得它在设计中能够降低对多级放大的需求,简化电路设计,提高系统的可靠性和效能。

应用领域

基于以上优越的性能指标,BFP840FESDH6327XTSA1 被广泛应用于以下领域:

  • 无线通信:用于手机、卫星通信和其他无线设备中的信号放大部分。
  • 射频设备:在射频发送和接收模块中作为低噪声放大器(LNA)。
  • 仪器仪表:在各种测量和测试设备中,提供增益和信号放大。
  • 汽车电子:在汽车雷达和其他高频率设备中,确保稳定的数据传输和信号处理。

总结

综上所述,BFP840FESDH6327XTSA1 是一款集高增益、低噪声和宽频带于一体的高性能 NPN 三极管,适用于要求严格的现代通信和无线设备。凭借其可靠性和卓越的电气性能,BFP840 自投放市场以来受到了设计工程师的广泛关注与青睐,是当今电子元件市场中不可或缺的重要组成部分。无论是在传统的 RF 应用还是新兴的物联网设备中,BFP840FESDH6327XTSA1 都展现出其广阔的市场价值和应用前景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.