WMSIC Electronic Components

Infineon BSC0902NS

ModelBSC0902NS
PackageTDSON-8(5x6)
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon BSC0902NS
Type
INFINEON
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BSC0902NS
Electronic Component
1
Package
TDSON-8(5x6)
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.16g
Electronic Component
1
Electronic Component
BM69419217
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
48W
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BSC0902NS

1. 产品简介

BSC0902NS是一款高性能的N沟道场效应管(MOSFET),由英飞凌(Infineon)公司制造。该器件专为高效能电子应用设计,具有出色的电流承载能力和较低的导通电阻,能够满足现代电源管理和开关电路的需求。BSC0902NS采用TDSON-8封装,尺寸为5x6 mm,适合高密度PCB布局,广泛应用于电源转换、马达驱动以及其他高频开关应用中。

2. 主要规格

  • 功率: 2.5W
  • 最大电压(VDS): 30V
  • 最大电流(ID): 24A
  • 封装类型: TDSON-8-EP(Enhanced Power)封装
  • 体积: 5mm x 6mm

3. 关键特性

  • 低导通电阻: BSC0902NS在导通状态下显示出极低的RDS(on)值,这有助于降低开关损耗,提高系统的整体效率。
  • 高热管理能力: 该MOSFET在TDSON-8封装中采用增强型设计,提供有效的散热解决方案,有助于在高负载条件下维持稳健的性能。
  • 快速开关速度: 设计上优化了开关速度,使其能够快速响应控制信号,适用于高频开关应用。
  • 高可靠性: 英飞凌作为一个知名的半导体制造商,其产品经过严格测试,确保了高质量与长期稳定性。

4. 应用领域

BSC0902NS的优秀特性使其在多种应用场景中展现出色的表现,包括但不限于:

  • 电源管理: 该MOSFET可用于DC-DC转换器、电源适配器和电池管理系统,提供高效能的电流控制。
  • 马达控制: 在电动机驱动电路中,BSC0902NS能够高效地控制电流,确保马达稳定运行,减少能量损耗。
  • 工业自动化: 在工业控制系统中,作为开关元件,BSCS0902NS可以实现快速开放和关闭,提供精准的控制能力。
  • 消费电子产品: 用于智能手机、平板电脑和其他便携式设备,提供高效的电源开关解决方案。

5. 电气特性和性能

  • 漏极源极击穿电压 (V(BR)DSS): BSC0902NS的VDSS值高达30V,能够处理多种工业与消费级应用的工作电压。
  • 最大连续漏极电流 (ID): 优越的24A电流能力,使其适合高负载电源管理任务。
  • 温度范围: 该器件设计适应-55°C到+175°C的宽工作温度范围,确保在极端工作环境下同样可靠。

6. 封装信息

BSC0902NS使用TDSON-8封装,这种封装方式不仅减少了占用的空间,更优化了热管理性能。封装设计旨在提高散热效率,适合高集成度的电路板设计需求。它的紧凑布局帮助设计师在有限的PCB面积内实现更高的功能性。

7. 竞争优势

与市场上同类产品相比,BSC0902NS凭借其卓越的电性能和可靠性,成为许多工程师的首选。英飞凌的品牌信誉,结合该器件在严格测试条件下展示的优异性能,使得它在业界内备受推崇。

8. 总结

BSC0902NS是一款综合能力强大的N沟道MOSFET,专为高效能应用而设计,适用于多种行业。其低导通电阻、高电流能力、以及稳定性使其在激烈竞争的市场中脱颖而出。通过采用此器件,设计师可以确保他们的产品在性能与效能上都能达到最高标准。无论是在电源管理、马达驱动还是其它高频开关应用中,BSC0902NS都将是一个极具竞争力的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.