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Infineon IRF3808STRLPBF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Infineon IRF3808STRLPBF
- Type
- INFINEON
- Minimum package
- 800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- INFINEON
- Electronic Component
- IRF3808STRLPBF
- Electronic Component
- 1
- Package
- D2PAK
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 2g
- Electronic Component
- 1
- Electronic Component
- BM0058402653
- Operating Temperature
- 55℃~+175℃
- Power Dissipation(Pd)
- 200W
- Electronic Component
- Electronic Component
- Electronic Component
- 800
- Voltage(Vdss)
- 75V
- Capacitor(Ciss)
- 5.31nF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IRF3808STRLPBF 产品概述
一、概述
IRF3808STRLPBF 为 Infineon（英飞凌）出品的 75V 单个 N 通道 HEXFET 功率 MOSFET，采用 D2PAK 表面贴装封装，适用于中高功率开关与同步整流场合。器件设计侧重低导通损耗与耐高温能力，结温工作范围宽（-55℃ 至 +175℃，Tj），可满足工业级和汽车级较苛刻的环境要求。
二、主要电气参数
- 漏-源电压（Vdss）：75V
- 导通电阻（RDS(on)）：7 mΩ @ VGS = 10V, ID = 82A
- 漏极连续电流（Id）：106A（条件依散热与封装限制）
- 门极阈值电压（Vgs(th)）：4V（典型）
- 总门极电荷（Qg）：220 nC @ VGS = 10V
- 输入电容（Ciss）：5.31 nF @ 25V
- 最大耗散功率（Pd）：200W（取决于散热条件）
- 工作结温范围：-55℃ ~ +175℃（Tj）
三、热与散热注意事项
D2PAK 为功率型表面贴装封装，热阻相对较低，但实际 Pd 和连续电流能力强烈依赖 PCB 铜箔面积与散热设计。推荐：
- 在散热面使用大面积铜箔、多个热过孔将热量导至反面或散热片；
- 评估实际结温时考虑 PCB 热阻和环境对流条件；
- 在高耗散工况下建议外接散热片或采用强制风冷。
四、驱动与开关性能建议
Qg = 220 nC 表明门极电荷偏大，开关时需要较大电流驱动：
- 使用专用驱动芯片或低阻抗门驱以获得快速且受控的开关；
- 合理选择门极电阻，平衡上升/下降时间与振铃、EMI；
- 对于高频开关应用，门驱能量和驱动拓扑需评估以控制开关损耗；
- Vgs(th) ≈ 4V，建议驱动电压以 10V 为目标以获得标称低 RDS(on)。
五、应用场景与布局要点
适用场景包括：同步整流、DC-DC 转换器、降压/升压拓扑、马达驱动及功率开关。布局建议：
- 将电流回路（漏-源）走短、粗的铜迹以降低电阻和电感；
- 门极与驱动器之间走线尽量短且加退耦电容；
- 高频开关处放置阻尼或 RC 吸收以降低电压尖峰；
- 并联使用时匹配 RDS(on) 与驱动相位，加入平衡措施以避免应力集中。
六、封装与可靠性
D2PAK（TO-263）封装适合自动化贴装与回流焊工艺，机械和热循环性能适合大多数工业应用。器件在高温工作时需关注热循环疲劳与焊点可靠性，建议按应用环境做加速寿命评估。
总结：IRF3808STRLPBF 在 75V 档位提供极低的导通电阻（7 mΩ@10V）和较大的电流处理能力，适合追求低导通损耗的功率设计。但较大的门极电荷要求稳健的驱动方案与合理的散热设计，以实现最佳效率与长期可靠性。
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