WMSIC Electronic Components

Infineon IRS2453DSTRPBF

ModelIRS2453DSTRPBF
PackageSOIC-14
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Infineon IRS2453DSTRPBF
Type
INFINEON
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
IRS2453DSTRPBF
Electronic Component
1
Package
SOIC-14
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
0.188g
Electronic Component
1
Electronic Component
BM0227677315
Operating Temperature
25℃~+125℃
Operating Voltage
10V~12V
Load Type
MOSFET
Driver
Electronic Component
Current(IOH)
180mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IRS2453DSTRPBF 产品概述

一、产品简介

IRS2453DSTRPBF 为 Infineon(英飞凌)出品的栅极驱动器,适配 MOSFET 驱动场景。器件以 SOIC-14 封装提供,单通道设计(含高、低侧驱动功能),常用于桥式功率变换器的栅极驱动子模块。在需要稳定开关控制、快速升跌沿及欠压保护的应用中具有良好性价比。

二、主要参数(概要)

  • 品牌:Infineon(英飞凌)
  • 封装:SOIC-14(无铅 PBF)
  • 驱动配置:面向全桥系统(单片单通道,高低侧驱动或多片并配实现全桥)
  • 负载类型:MOSFET
  • 驱动通道数:1(半桥驱动单元)
  • 工作电压:VCC 约 10V ~ 12V
  • 灌电流(IOL,sink):260 mA
  • 拉电流(IOH,source):180 mA
  • 上升时间 tr:约 120 ns
  • 下降时间 tf:约 50 ns
  • 静态电流 Iq:约 1.3 mA
  • 工作温度(结温):-25 ℃ ~ +125 ℃
  • 保护特性:欠压保护(UVP)

三、功能与保护特性

IRS2453DSTRPBF 提供对 MOSFET 栅极的强拉/灌电流能力,可实现较快的栅极充放电,从而缩短开关切换时间、降低开关损耗。内建欠压保护(UVP)防止在驱动电压不足时错误驱动功率器件,提升系统可靠性。较小的静态电流(Iq≈1.3 mA)有利于待机功耗控制。

四、典型应用场景

  • 全桥/半桥逆变器与电机驱动(可通过单片或多片配合实现全桥)
  • 开关电源(SMPS)前端或中大功率变换器的栅极驱动
  • 光伏逆变器 / 储能变流器中的功率开关控制模块
  • 需要欠压保护与中等开关速度的工业电源与电力电子系统

五、封装与热管理注意

SOIC-14 封装便于 PCB 布局与散热器件结合,但在高频高功率工作时需关注结温(Tj)控制。建议合理安排铜箔面积、接地面和热过孔,保证驱动 IC 的散热通道。器件额定工作温度上限为 +125 ℃(Tj),设计时应留有裕量。

六、布局与使用建议

  • 电源旁加稳压去耦电容(VCC 近端布局),减小供电回路寄生电感。
  • 栅极连线尽量短且粗,减少环路阻抗以降低 EMI 和振铃。
  • 使用合适的栅极电阻以控制开关速率并匹配器件的拉/灌能力(参考 tr/tf)。
  • 在全桥应用中,若使用多片 IRS2453 组合驱动,注意同步逻辑、死区时间和各片欠压保护的交互。
  • 对于高 dv/dt 场合,考虑增加栅极驱动保护(TVS、RC 缓冲、米勒回补等)以防误触发。

综上,IRS2453DSTRPBF 是一款面向 MOSFET 驱动的稳健栅极驱动器,适用于要求欠压保护、适中开关速度与较强瞬态驱动能力的工业与电力电子应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.