WMSIC Electronic Components

Infineon BFR380FH6327XTSA1

ModelBFR380FH6327XTSA1
PackageTSFP-3
BrandInfineon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Infineon BFR380FH6327XTSA1
Type
INFINEON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
INFINEON
Electronic Component
BFR380FH6327XTSA1
Electronic Component
1
Package
TSFP-3
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.473g
Electronic Component
1
Electronic Component
BM0077804376
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
14GHz
Power Dissipation(Pd)
380mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BFR380FH6327XTSA1 NPN 晶体管

概述

BFR380FH6327XTSA1 是一款高性能的 NPN 型晶体管,专为高频信号放大和开关应用而设计。此组件由著名的电子元器件制造商 Infineon(英飞凌)生产,采用表面贴装型(TSFP-3)封装,具有出色的电气和热性能,使其成为现代通信、射频(RF)及消费电子产品中的理想选择。

关键参数

  • 晶体管类型: NPN
  • 极限电压: 集射极击穿(Vce_max)可达 9V,这使其适用于对电压有一定要求的电子电路。
  • 集电极电流(Ic): 最大值为 80mA,适合中等功率的应用场景。
  • 频率响应: 其频率跃迁值高达 14GHz,适合高频信号的处理,特别是在无线通信中。
  • 功率: 最大功率输出达到 380mW,能够在高负载条件下可靠工作。
  • 工作温度: 最高结温为 150°C,使其在高温环境中也能保持稳定性能。

性能特征

BFR380FH6327XTSA1 展示出卓越的电流增益 (hFE),在不同的 Ic 和 Vce 下,至少可实现 90 的增益,尤其在 40mA 和 3V 时表现良好。这一特性使其在放大小信号方面表现出众,非常适合于低噪声放大器(LNA)的设计应用。

该晶体管的噪声系数相对较低,在 1.8GHz 至 3GHz 的频率范围内,噪声系数介于 1.1dB 至 1.6dB 之间,意味着在高频操作时,信号损失和干扰较小,能够有效提高系统整体的信噪比。

增益范围在 9.5dB 至 13.5dB 之间,为多种应用提供了灵活的设计选择。无论是在射频放大、混频电路,还是在高频开关电源中,BFR380FH6327XTSA1 都能提供卓越的增益性能。

应用领域

BFR380FH6327XTSA1 适用范围广泛,主要包括:

  • 无线通信: 在手机基站、移动终端及其他无线通讯设备中,作为射频放大器或开关,实现高效稳定的信号放大。
  • 消费电子: 可以用于电视调谐器、音频设备及其他高频应用中,保障信号质量。
  • 测试与测量设备: 在需要精确测量和高频数据采集的场合,可以作为信号放大组件。
  • 工业控制: 适合用于各种自动化及控制系统中,增强信号处理能力。

结论

综上所述,BFR380FH6327XTSA1 是一款极具竞争力的 NPN 晶体管,凭借其高频性能、出色的电流增益和良好的热稳定性,使其在现代电子应用中具备了不可替代的价值。无论是在通信、消费电子还是工业控制领域,BFR380FH6327XTSA1 都能够满足严格的性能要求,并为用户带来高品质的信号处理解决方案。对于研发工程师及设计师而言,此款晶体管无疑是实现高效能电路设计的重要工具。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.