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IHHEC C1206N222J102T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- IHHEC C1206N222J102T
- Type
- IHHEC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- IHHEC
- Electronic Component
- C1206N222J102T
- Electronic Component
- 1
- Electronic Component
- 2.2nF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.049g
- Electronic Component
- 1
- Electronic Component
- BM0264490583
- Electronic Component
- NP0
- Voltage
- 1kV
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1206N222J102T 产品概述
一、产品简介
C1206N222J102T 为 IHHEC（禾伸堂）系列高压多层陶瓷贴片电容（MLCC），额定电压 1kV，容量 2.2nF，温度特性为 NP0（又称 C0G），封装为 1206（约 3.2 × 1.6 mm）。该器件为非极性、低温漂、高稳定性的片式电容，适合对电容稳定性和低损耗有较高要求的高压及高频场景。
二、主要参数
- 容值：2.2nF（±5%，J）
- 额定电压：1kV DC
- 温度系数：NP0/C0G（典型温漂极小，±30 ppm/°C 级）
- 封装：1206（3216 公制）
- 材料/介质：NP0 多层陶瓷
- 引脚形式：端接电极，适合回流焊
- 合规性：无铅、符合 RoHS 要求
三、产品特点
- 温度稳定性高：NP0 特性保证电容随温度变化极小，适用于精密滤波和谐振回路。
- 低损耗、高 Q 值：在高频条件下表现优异，漏电流低、介质耗散因数小。
- 耐压能力强：1kV 的额定电压满足高压隔离与脉冲应用需求。
- 封装标准化：1206 尺寸兼顾容值与可焊接性，便于自动贴装与回流焊工艺。
四、典型应用
- 高压电源与升压模块的旁路/滤波
- 精密振荡器、时钟与谐振电路
- 高频滤波、阻抗匹配及射频前端（在允许电压下）
- 脉冲电路、隔离电压分压、医疗与工业高压装置
五、封装与可靠性
1206 封装兼容主流贴片工艺，推荐遵循 JEDEC/IPC 回流焊温度曲线进行焊接。NP0 陶瓷在机械应力与热循环下表现稳定，但在高应力装配或过度弯曲基板时仍需注意裂纹风险，建议合理设计焊盘与过孔，采用短而对称的焊点以降低应力集中。
六、设计与使用建议
- 在高压应用中建议适当留有安全余量并考虑电压击穿和在板上爬电距离要求。
- 为保证长期稳定性，注意回流焊峰值温度和焊接时间，避免重复热循环。
- 储存时保持干燥并避免受潮，必要时在焊接前进行预烘烤以去除吸湿。
- 对于要求极低电容漂移的应用，优先选用 NP0 等级并在设计时控制温度环境。
七、采购与替代
IHHEC（禾伸堂）制造，适合批量 SMT 贴装采购。若需替代，可考虑同规格的主流厂商型号（如 Murata、TDK、KEMET 等）但需核对额定电压、温漂等级及封装一致性，完成可靠性与电气性能的实际验证。
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