WMSIC Electronic Components

IHHEC C0805N101J102T

ModelC0805N101J102T
Package0805
BrandIHHEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

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Technical data

Product details

18 specifications

Core information

Product name
IHHEC C0805N101J102T
Type
IHHEC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
IHHEC
Electronic Component
C0805N101J102T
Electronic Component
1
Electronic Component
100pF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0265604335
Electronic Component
NP0
Voltage
1kV
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

C0805N101J102T 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本定位

C0805N101J102T是禾伸堂(IHHEC) 推出的0805封装贴片多层陶瓷电容(MLCC),属于NP0(COG)系列,主打高稳定性、高耐压核心特性,容值100pF、精度±5%、额定电压1kV,是高频电路、工业控制等对容值一致性要求严苛场景的基础元件。

二、核心性能参数(典型值)

参数 规格值 关键说明 标称容值 100pF(标识:101) 10×10¹=100pF,符合IEC 60063标准 容值精度 ±5%(标识:J) 生产管控一致性达±0.3%(批量水平) 额定直流电压 1kV 最大持续工作电压,无瞬间过压设计 封装尺寸 0805(英制) 公制2012,实际尺寸2.0×1.2×1.0mm 温度系数 NP0(COG) -55℃~+125℃内变化≤±30ppm/℃ 损耗角正切(tanδ) ≤0.15%(1kHz,25℃) 高频损耗极低,适合射频信号传输 绝缘电阻(IR) ≥10¹⁰Ω(25℃,10V DC) 漏电流≤1nA,抗干扰能力强 工作温度范围 -55℃ ~ +125℃ 工业级宽温,支持极端环境应用 环保认证 RoHS 2.0、REACH 无铅无卤,符合全球环保标准

三、封装与结构优势

  1. 小尺寸高密度布局:0805封装(2.0×1.2mm)适配小型化PCB设计,满足消费电子、车载设备的空间限制;
  2. 精密叠层工艺:陶瓷介质层与银钯内电极交替叠放,容值一致性优于行业平均水平,避免批次差异;
  3. 抗硫化端电极:采用「镍层+锡层」三层结构,有效抵抗空气中硫化物侵蚀,降低焊接后开路风险;
  4. 焊接兼容性:支持回流焊(峰值温度≤245℃)、波峰焊(需控制预热温度),符合IPC-J-STD-020标准。

四、材料与温度特性

本型号采用NP0陶瓷介质(非极性,介电常数≈15),核心性能优势:

  • 温度稳定性:-55℃~+125℃范围内,容值变化≤0.03%,远优于X7R(±15%)等温度补偿型电容;
  • 无直流偏置效应:直流电压下容值无明显下降(X7R在10V下容值可能降低20%),适合电源滤波、信号耦合;
  • 高频阻抗平坦:在100MHz~1GHz频段保持低阻抗特性,满足射频通信、微波电路的信号传输需求。

五、典型应用场景

  1. 射频通信设备:基站RRU、无线路由器、蓝牙5.0模块的信号耦合/滤波电容;
  2. 工业控制电路:PLC、变频器中的高压电源滤波、传感器信号调理;
  3. 汽车电子:车载T-BOX、ADAS传感器电路(部分批次符合AEC-Q200认证);
  4. 测试仪器:示波器、信号发生器的高频通道滤波、谐振回路电容;
  5. 医疗设备:监护仪、超声设备中的低噪声信号耦合电容。

六、选型与使用注意事项

  1. 电压裕量设计:电路最大工作电压需≤额定电压的80%(1kV型号建议≤800V DC),避免过压失效;
  2. 焊接管控:回流焊峰值温度≤245℃(持续时间≤10s),避免介质层开裂;
  3. 储存条件:未开封产品储存在25℃±5℃、湿度≤60%环境,开封后12个月内使用完毕;
  4. 容值范围限制:NP0系列容值为1pF~1000pF,若需更大容值高耐压,需切换至Y5V系列(稳定性下降)。

本型号通过禾伸堂严格可靠性测试(高温高湿、温度循环、振动测试),可稳定应用于工业、汽车、通信等领域的关键电路。

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