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IHHEC C1812X103K302T
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- IHHEC C1812X103K302T
- Type
- IHHEC
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- IHHEC
- Electronic Component
- C1812X103K302T
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 1812
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.24g
- Electronic Component
- 1
- Electronic Component
- BM0264490370
- Electronic Component
- X7R
- Voltage
- 3kV
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1812X103K302T 产品概述
一、产品简介
C1812X103K302T 是 IHHEC（禾伸堂）推出的一款高压贴片多层陶瓷电容（MLCC），标称容量 10nF（103），容差 ±10%（K），额定直流电压 3kV（302），介质为 X7R，封装为 1812（约 4.6 × 3.2 mm）。本型号针对高电压、小体积、高可靠性场合设计，适合需要在有限空间内实现高压阻尼、隔直或旁路的应用。
二、主要参数与特性
- 容值：10nF，容差 ±10%
- 额定电压：3kV DC（设计用于高压环境）
- 介质类型：X7R（温度范围 -55 ℃ 至 +125 ℃，典型温度依赖范围内容量变化约 ±15%）
- 封装：1812（适配常见贴片装配流程）
- 构造优势：高压设计的介质厚度与电极结构使得在高电压下比低压同类产品具有更好的耐压与漏电特性
- 电气性能：低至中等介质损耗（适合旁路/去耦/耦合用途），在直流偏置下容量会有一定下降，建议在目标工作电压下进行实际测量验证
三、典型应用场景
- 高压电源与直流/脉冲电路的耦合与去耦
- 高压检测、分压器中的耦合与旁路元件
- 医疗、高压绝缘测试设备、工业电源、激光电源、X 射线/离子源等高压模块
- 高频脉冲抑制与阻尼网络（需关注脉冲能量与温升）
注意：本型号不是安规安全电容（非 X/Y 安规等级），不能替代用于直接跨工频电网两端或对地的安规电容。
四、安装与焊接建议
- 推荐采用自动贴装与回流焊工艺，遵循厂商回流曲线（峰值温度通常不超过 260 ℃，避免热冲击）
- 贴片时避免在电容体上施加过大机械应力，焊盘设计与焊料体积应控制在合理范围以减少应力集中
- 对于 1812 尺寸，常规板上焊盘与焊膏量即可满足良好焊接，必要时做应力缓冲结构或阻尼胶固定
五、可靠性与检验
- 建议在样机阶段进行耐压、绝缘电阻、温升、温度循环及直流偏置下容量保持性等验证
- 出货前常见测试包括外观、体积电容、绝缘电阻及高压耐压测试
- 长期使用注意环境湿度、热循环和机械震动对寿命的影响
六、选型与替代建议
- 若工作温度或容量稳定性要求更高，可考虑 C0G/NP0 等一类介质（但同等体积下难以达到 3kV 与 10nF）
- 若需要安规等级，请选择专门的 X/Y 安规电容或通过系统隔离设计替代
- 订购时确认包装（常见为卷带包装 Tape & Reel）、批次及规格编码一致性，样件验证后再量产替换
总结：C1812X103K302T 提供在紧凑封装中实现 3kV 耐压与 10nF 容值的平衡方案，适用于多种高压电子系统的耦合、旁路和抑制场合。选型时应结合直流偏置、温度特性与实际工况做验证，确保可靠运行。
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