Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
IHHEC C1812X223K202T
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- IHHEC C1812X223K202T
- Type
- IHHEC
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- IHHEC
- Electronic Component
- C1812X223K202T
- Electronic Component
- 1
- Electronic Component
- 22nF
- Package
- 1812
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.236g
- Electronic Component
- 1
- Electronic Component
- BM0264490365
- Electronic Component
- X7R
- Voltage
- 2kV
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1812X223K202T 产品概述
一、产品简介
C1812X223K202T 是禾伸堂（IHHEC）推出的一款高压片式多层陶瓷电容（MLCC），标称容量 22nF（223）、容差 ±10%（K）、额定电压 2kV（2000V），温度特性为 X7R（−55°C 至 +125°C，容量变化限制 ±15%）。封装为经典 1812（约 4.6mm × 3.05mm），适配自动贴装与流焊工艺，面向高压滤波、耦合、退耦及脉冲应用。
二、主要规格与电气特性
- 容量：22 nF（±10%）
- 额定电压：2000 V DC
- 温度系数：X7R（−55°C ～ +125°C，典型容量变化 ±15%）
- 封装：1812（约 4.6 × 3.05 mm）
- 典型介质特性：介电常数较高、等效串联电阻（ESR）低、等效串联电感（ESL）适中
- 工作环境：适用于常温至高温电路，需注意直流偏压与温漂影响
三、关键特性与设计注意点
- 高压能力：2kV 额定电压可直接用于高压供电、加速电路和高压隔离场合，但并非安全/安规电容（非 X/Y 级），不能替代安全认证的跨线或接地电容。
- DC 偏压效应：X7R 在高电场下会出现容量下降，尤其在接近额定电压时容量会明显降低；建议在设计中进行实测或预留裕量。
- 温度行为：X7R 在温度范围内保持较稳定的容量，适合对温漂有一定容忍度但又要求体积和电容量平衡的场合。
- 机械与热应力：1812 体积较大，贴装时要控制焊膏量与回流曲线，避免因温度骤变或偏心应力导致晶片裂纹。
四、典型应用
- 高压耦合与去耦电路
- 脉冲成形、储能与吸收（需评估峰值电流与寿命）
- 高压电源滤波与抑制干扰
- 工业、电力电子、医疗成像与检测设备中高压部分（非直接替代安规电容的情况下）
五、封装、焊接与可靠性建议
- 推荐贴片与回流焊工艺，遵循 JEDEC/IPC 回流温度曲线，峰值温度不超过 260°C。
- 贴装前对元件进行防潮包装与必要的预烘烤（根据出厂包装和维修流程），以降低焊接裂纹风险。
- 设计 PCB 焊盘时注意应力缓释（对称焊盘、合理焊膏印刷）并避免过大焊盘差异引起的热机械应力。
- 建议在实际应用中对电压、温度和寿命进行加速试验验证，以确定长期可靠性与容量保持率。
六、选型与订购建议
- 若电路对容量稳定性要求极高或需极低的 DC 偏压效应，可考虑 C0G/NP0 类型；若体积或电压要求更高，可选更大封装或多片并联/串联设计。
- 订购时请确认完整料号、包装方式（卷带规格）、批次与生产测试报告。常见料号解析：C1812（封装） X（X7R） 223（22nF） K（±10%） 202（2kV） T（卷带包装）。
如需更多详细参数（耐压冲击、绝缘电阻、典型 DC 偏压曲线、包装数量等）或样品测试数据，可提供具体应用电路与工作条件，我将协助给出更精确的选型与使用建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
