Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
UMSB40M是晶导微电子推出的一款单相整流桥,采用UMSB表面贴装封装,属于中功率整流器件范畴。该产品以4A连续整流电流、1kV直流反向耐压为核心性能指标,兼顾低损耗、宽温适应性与抗浪涌能力,可满足工业控制、家电、通讯及中小功率电源等多领域的整流需求,是一款性价比突出的通用型整流桥产品。
UMSB40M的电气参数经过精准设计,平衡了性能与可靠性,关键参数的实际价值如下:
正向压降是整流桥导通时的电压损耗,UMSB40M在额定连续电流4A下仅为1.6V,远低于同类产品的平均水平(部分竞品可达1.8V以上)。低正向压降直接降低导通损耗,减少器件发热,提升电源转换效率,尤其适合长时间连续工作场景,可降低散热系统成本。
1kV的反向耐压覆盖中高压整流主流需求(如220V市电整流安全余量充足,部分工业380V系统也可适配),确保反向偏置时不击穿,提升工作稳定性。
额定连续电流4A满足中小功率设备整流需求(如500W以内开关电源、LED驱动电源),额定电流下可长期稳定工作,无需额外降额设计(系统需求接近4A时可直接选用)。
反向漏电流是器件反向截止时的漏失电流,UMSB40M在1kV反向电压下仅为5μA,远低于行业标准(通常≤10μA)。低漏电流减少反向损耗,延长器件寿命,尤其适合对功耗敏感的通讯、便携式设备。
95A的浪涌电流能力可应对设备启动瞬间的大电流冲击(如开关电源开机电容充电浪涌、电机启动瞬时电流),避免器件因浪涌击穿,提升系统抗干扰能力。
宽温范围覆盖工业级环境温度波动(如户外设备、车间控制设备的低温启动与高温工作),无需额外温度补偿,适配极端工况。
UMSB是晶导微电子针对表面贴装场景优化的封装形式,具有以下特点:
UMSB40M的参数与封装特性适配多领域应用:
晶导微电子是国内功率半导体核心企业,专注整流桥、二极管、MOSFET等器件研发生产,产品通过ISO9001、IATF16949等国际认证,广泛应用于汽车电子、工业控制、消费电子领域。UMSB40M经过严格可靠性测试(高低温循环、浪涌冲击、振动测试),品质稳定可靠,可替代进口同类产品,具备显著成本优势。
UMSB40M是一款高性价比通用型单相整流桥,核心亮点包括:4A/1kV均衡性能、1.6V低正向压降、95A抗浪涌能力、-55~150℃宽温范围,以及UMSB表面贴装的紧凑设计。该产品适配多领域中小功率整流需求,是工业控制、家电、通讯等行业替代进口、降低成本的理想选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products