WMSIC Electronic Components

JSMSEMI S8550

ModelS8550
PackageSOT-23
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI S8550
Type
JSMSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
S8550
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.187g
Electronic Component
1
Electronic Component
BM0257671493
Transistor Type
PNP
Frequency(f T)
150MHz
Power Dissipation(Pd)
625mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
500mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S8550(JSMSEMI)PNP 小信号三极管 产品概述

一、产品简介

S8550 为 JSMSEMI(杰盛微)推出的一款小信号 PNP 双极型晶体管,采用 SOT-23 小封装,适用于便携式和空间受限的电路板设计。器件针对低压、低功耗及中等频率放大场合优化,兼顾开关与放大两类应用需求,是常见的通用型 PNP 器件之一。

二、主要电气参数

  • 集电极电流 Ic:500 mA(最大额定电流)
  • 集—射极击穿电压 Vceo:25 V(器件稳健工作上限)
  • 耗散功率 Pd:225 mW(SOT-23 封装功耗限制,需做好散热设计)
  • 特征频率 fT:150 MHz(高频特性良好,适用于几十 MHz 频段放大)
  • 集电极截止电流 Icbo:100 nA(典型低漏电流)
  • 集电极饱和电压 VCE(sat):约 600 mV(具体数值随测试条件变化)
  • 射极-基极击穿电压 Vebo:5 V

以上参数为器件典型或最大额定值,电路设计请参照完整数据手册中的测试条件和曲线图。

三、结构与封装

S8550 为独立式三引脚元件,采用 SOT-23 小型表面贴装封装,便于自动贴装与批量生产。SOT-23 的热阻较大,单颗器件功耗受限,建议在 PCB 设计中配合铜箔散热片或多层结构以提升热量扩散能力。具体引脚排列请以厂商封装图为准。

四、主要性能特点

  • 低压大电流:最高集电极电流达 500 mA,适合驱动小功率负载与开关应用。
  • 高频响应好:150 MHz 的特征频率使其在射频前端、宽带放大及高速开关场景中表现较佳。
  • 低漏电与可靠性:Icbo 仅 100 nA,利于低静态电流系统设计。
  • 开关饱和压适中:VCE(sat) 约 600 mV,在需要低压降驱动时需权衡。
  • 体积小、适合高密度安装:SOT-23 封装便于便携设备应用。

五、典型应用场景

  • 便携电子设备中的低频放大与驱动电路
  • 低电压开关、复位与控制电路
  • 音频前级放大、信号缓冲
  • 中低功率射频与宽带放大(需注意功耗与热管理)
  • 通用替换与原型验证

六、使用与注意事项

  • 功耗限制严格:SOT-23 封装下 Pd=225 mW,应避免长时间在高 Ic 与高 Vce 条件下工作,必要时通过 PCB 散热与降低占空比来控制结温。
  • 测试条件差异:VCE(sat) 与 fT 等参数受测试电流、频率与温度影响,设计时参考厂商完整特性曲线。
  • 反向击穿保护:Vebo=5 V,基极不要承受超过额定反向电压以防损坏。
  • 焊接与回流工艺:遵循 SOT-23 回流曲线,避免过高温度或超时导致性能退化。

七、选型建议与替代

S8550 适合需要 PNP 小信号放大或中等驱动能力的场合。若应用对功耗或饱和电压要求更严格,可考虑功耗更大或 VCE(sat) 更低的替代件;若需更高频率性能,可选取 fT 更高的器件。最终选型请结合实际工作电流、工作电压、散热条件和成本进行综合评估,并参考 JSMSEMI 的完整数据手册以获得详细特性与封装图。

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