WMSIC Electronic Components

JSMSEMI JSM4953

ModelJSM4953
PackageSOP-8
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI JSM4953
Type
JSMSEMI
Minimum package
3000

Technical parameters

Electronic Component
JSMSEMI
Electronic Component
JSM4953
Electronic Component
1
Package
SOP-8
Electronic Component
2 P
Electronic Component
MOSFET
Electronic Component
0.195g
Electronic Component
1
Electronic Component
BM0258706479
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2W
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
528pF
Gate (Qg)
6nC@15V
Resistor(RDS(on))
89mΩ@4.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

JSM4953 产品概述

一、产品简介

JSM4953 是 JSMSEMI(杰盛微)推出的一款双路 P 沟道场效应管(MOSFET),封装为 SOP-8,集成两颗 P 沟道晶体管,适合中低压高侧开关与电源管理应用。器件在室温下具有低导通电阻与中等开关速度的特性,在便携设备、电源路径切换及保护电路中具备良好性价比。

二、主要参数

  • 通道数:2 个 P 沟道
  • 漏–源电压 (Vdss):30 V
  • 连续漏极电流 (Id):5.3 A
  • 导通电阻 RDS(on):89 mΩ @ Vgs = 4.5 V, Id = 4.2 A
  • 功耗 (Pd):2 W
  • 阈值电压 Vgs(th):3 V
  • 总栅极电荷 Qg:6 nC @ Vgs = 15 V
  • 输入电容 Ciss:528 pF;反向传输电容 Crss:70 pF
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOP-8(双通道封装)

三、关键特性

  • 低压差导通:在 Vgs ≈ -4.5 V 时 RDS(on) 仅 89 mΩ,适合低压高侧开关场景。
  • 开关损耗-功率平衡:Qg = 6 nC 与 Ciss/Crss 指标表明器件为中等开关速度,兼顾效率与 EMI。
  • 宽工作温度范围,适应工业级温度变化。
  • 双通道 SOP-8 便于版面集成与两路独立或并联应用。

四、典型应用

  • 电池供电设备的高侧开关与电源路径控制(如便携终端、移动电源)。
  • 负载断开/倒车防护电路与热插拔开关。
  • 逆变器/DC-DC 前级保护与旁路开关(需按功耗评估)。
  • 电机驱动或继电器驱动的低压控制回路(中小功率)。

五、设计与使用建议

  • 为获得标称 RDS(on),在高侧应用需对栅极施加相对源极合适的负偏压(参考数据手册的 Vgs 要求)。
  • 导通损耗示例:在 4.2 A 下 4.2^2×0.089 ≈ 1.57 W 的导通功耗,接近器件 Pd = 2 W,实际应用应考虑 PCB 散热和并联或降低平均电流。
  • 推荐在栅极串联合理阻值以抑制振铃并限制浪涌电流,必要时加 TVS 或钳位电路防止瞬态过压。
  • 布局时在器件引脚下方增加铜面和热沉区域,必要时使用多孔过孔导热到内层或背面铜箔以提升散热能力。

六、封装与热管理

SOP-8 小型封装便于自动贴装,但热阻相对较高。对于连续大电流或高频切换场合,建议加大 PCB 铜箔面积、使用散热层和多个过孔以降低结壳温升,确保器件在额定温度范围内稳定工作。

七、可靠性与采购

JSM4953 适合追求成本与集成度的中低压电源设计。具体的最大 Vgs、脉冲能力和封装热阻等详细参数,请以官方数据手册为准;批量采购与技术支持可联系 JSMSEMI(杰盛微)授权渠道。

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