WMSIC Electronic Components

JSMSEMI C1815

ModelC1815
PackageSOT-23
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI C1815
Type
JSMSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
C1815
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0263523366
Transistor Type
NPN
Frequency(f T)
80MHz
Power Dissipation(Pd)
400mW
Electronic Component
Electronic Component
Electronic Component
3000
Collector Current(Ic)
150mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

C1815 产品概述

一、产品简介

C1815(JSMSEMI 杰盛微,封装 SOT-23)是一款用于小信号放大与开关的 NPN 晶体管。器件在小电流放大和低功耗开关场合表现良好,具有较高的直流电流增益和中等频率特性,适合便携式电子、传感器前端、信号放大及驱动小型负载等应用。

二、主要电气参数(摘要)

  • 晶体管类型:NPN(小信号晶体管)
  • 集电极电流 Ic:150 mA(最大)
  • 集射极击穿电压 Vceo:50 V(最大)
  • 耗散功率 Pd:400 mW(在规定散热条件下)
  • 直流电流增益 hFE:400(大值,低电流区高增益)
  • 特征频率 fT:80 MHz(增益带宽特性,适用于中频应用)
  • 集电极截止电流 Icbo:100 nA(典型/最大值,表征漏电)
  • 集射极饱和电压 VCE(sat):≈250 mV(导通饱和时典型值)
  • 射基极击穿电压 Vebo:5 V(基-射间反向耐压)

以上参数为器件典型/最大规格,请以厂商正式数据手册为准。特别注意:诸如 VCE(sat)、hFE 等参数随工作点、温度及测试条件变化较大,设计时需考虑实际工况。

三、封装与引脚

  • 封装:SOT-23,体积小、便于表贴安装。
  • 常见引脚排列(不同厂商可能略有差异)通常为:1—B(基极),2—E(射极),3—C(集电极)。在设计 PCB 前请以 JSMSEMI 的官方引脚图为准,避免因封装脚位差异造成焊接或功能错误。

四、典型应用场景

  • 小信号前置放大器:高 hFE 在低电流区域能提供较大增益,适用于麦克风、传感器等低电流信号放大。
  • 开关驱动:可作为逻辑级驱动小型继电器、LED 或其他 100 mA 级负载的开关元件(需注意饱和驱动电流与功耗)。
  • 电平转换与接口缓冲:在 50 V 以内电压等级下用于信号接口缓冲与电平移位。
  • 中低频射频电路:fT≈80 MHz,可用于几十 MHz 范围内的放大,但并非高频功率放大器首选。
  • 静态电流要求低的便携设备:低 Icbo 利于提高休眠时的电池寿命。

五、使用建议与热设计要点

  • 功耗限制:Pd 为 400 mW,工作时需确保器件功耗(P = VCE × Ic)低于此值并留有适当裕量。例如当 VCE=3 V、Ic=100 mA 时,消耗功率为 0.3 W,可在合理散热条件下使用;若 VCE 或 Ic 更高,必须通过 PCB 铜箔散热或降低工作电压/电流来保证安全。
  • 饱和驱动:若作为开关使用,为使器件进入饱和区通常需要足够的基极电流(实际所需 Ib 与目标饱和度、负载和温度有关),设计时按保守的强迫 β(例如 10–20)计算基极电流,并考虑驱动源能力。
  • 极限电压与极间保护:避免基-射极反向电压超过 5 V(Vebo),防止基极结损坏;集电极-射极电压应低于 50 V。
  • 漏电与温度:Icbo 在高温下会增大,热稳定性与电路偏置需联合考虑。
  • ESD 与静电防护:SOT-23 器件对静电敏感,生产与装配过程中应采取防静电措施。

六、焊接与储存建议

  • 在贴片焊接时遵循厂商推荐的回流焊温度曲线与湿敏等级(MSL)要求;如无手册信息,应采用常规无铅回流参数并在合格条件下进行可靠性验证。
  • 储存时建议干燥、避光、低湿环境,长期库存按干燥包装(dry-pack)管理,避免吸湿后回流焊时产生焊接缺陷。

七、采购信息

  • 品牌:JSMSEMI(杰盛微)
  • 封装:SOT-23
  • 数量:1 个(可按项目需求批量采购)
  • 选型提示:在批量采购或可靠性设计前,建议索取并核对 JSMSEMI 的完整数据手册与封装图纸,以确保引脚排列、典型曲线与可靠性指标满足应用要求。

八、总结与推荐

C1815(SOT-23)是一款以高直流增益和中等频率特性为亮点的小信号 NPN 晶体管,适合低电流放大与小功率开关场合。在使用时应重点关注功耗限制与温度管理、基极驱动电流以及最大电压等级。对于对性能和可靠性有更高要求的设计,建议参照厂方完整数据手册并在目标应用环境下做实际验证测试。

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