WMSIC Electronic Components

JSMSEMI DRV8870DDAR

ModelDRV8870DDAR
PackageESOP-8
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI DRV8870DDAR
Type
JSMSEMI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
DRV8870DDAR
Electronic Component
1
Package
ESOP-8
Electronic Component
Brushed DC Motor Driver IC
Electronic Component
0.329g
Electronic Component
1
Integrated FET
Electronic Component
Features
Current Sampling
Electronic Component
BM0257700091
Resistor
600mΩ
Current
3.5A
Operating Temperature
40℃~+125℃
Operating Voltage
8V~38V
Static Current(Iq)
10uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DRV8870DDAR 产品概述

DRV8870DDAR 为 JSMSEMI(杰盛微)推出的一款单通道高侧/低侧集成功率FET驱动器,面向汽车级及工业级直流电机、执行器与电磁负载驱动场景。器件集成功率MOSFET,简化了外部器件设计并提升可靠性,适用于8V~38V的工作电源范围,兼顾宽电压适应性与热性能设计。

一、主要规格亮点

  • 集成FET:器件内部包含高/低侧功率MOSFET,简化系统设计与焊接。
  • 峰值电流:3.5A,满足短时冲击和启动电流需求。
  • 工作电压:8V~38V,适配常见车载与工业电源。
  • 导通电阻(Rds(on)):600mΩ(典型),用于估算导通损耗与热升。
  • 静态电流(Iq):10µA,静态功耗低,利于低待机能耗应用。
  • 工作温度:-40℃ ~ +125℃,覆盖工业与车规常见温度范围。
  • 封装:ESOP-8,便于自动化贴片与散热设计。

二、应用场景

  • 小型有刷直流电机驱动(齿轮箱、风扇、泵等)。
  • 电磁阀、继电器线圈、致动器控制。
  • 工业控制系统、楼宇自动化及车载辅助设备。
  • 需要宽工作电压、低静态功耗与抗冲击能力的场合。

三、设计与热管理建议

  • 由于Rds(on)为600mΩ,连续工作时会产生显著功耗(P = I^2·R),需根据最大工作电流计算总体损耗并做好散热。推荐在PCB上使用大面积铜箔和热通孔连接底部散热层。
  • 封装ESOP-8应尽量在焊盘下方设计热沉焊盘或连接到散热地层,以降低结壳温差并提升可靠电流能力。
  • 对于高频启停或频繁反向过冲的负载,建议在电源侧添加合适的去耦电容与反向抑制元件,保护器件免受瞬态电压冲击。

四、使用注意事项

  • 在峰值电流附近长时间工作将导致过热或损坏,应留有安全裕度并考虑降额使用。
  • 线路布局应最小化驱动回路的环路面积,靠近器件放置去耦电容,避免电磁干扰。
  • 工作环境若存在高温、高湿或腐蚀性介质,应按相关可靠性规范进行封装和保护处理。

五、总结

DRV8870DDAR 以集成FET、宽电压范围与低静态电流为主要优势,适合要求体积小、结构简单且需承受短时大电流的直流负载驱动应用。合理的PCB热设计与电源滤波可显著提升其长期稳定性与使用寿命。若需并联或提升持续输出能力,建议结合系统热仿真与实际负载测试调整设计方案。

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