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JSMSEMI 2N7002K
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JSMSEMI 2N7002K
- Type
- JSMSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JSMSEMI
- Electronic Component
- 2N7002K
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.1g
- Electronic Component
- 1
- Electronic Component
- BM0257629852
- Operating Temperature
- 65℃~+150℃
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 60V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2N7002K 产品概述
一、概述与主要参数
2N7002K（JSMSEMI 杰盛微）是一款 SOT-23 封装的 N 沟道小信号场效应管，适用于低功耗开关与信号级应用。关键参数包括：漏源耐压 Vdss = 60V；连续漏极电流 Id = 300mA；导通电阻 RDS(on) = 7.5Ω（Vgs=10V，Id=0.5A）；耗散功率 Pd = 350mW；阈值电压 Vgs(th) = 2.4V。栅极电荷 Qg ≈ 3nC（Vgs=10V），输入电容 Ciss = 33pF、输出电容 Coss = 14pF、反向传输电容 Crss = 9pF。工作温度范围为 −65℃ 到 +150℃。
二、器件特性与电气意义
该器件定位为小信号 MOSFET：60V 的耐压使其在中等电压场景（例如 12V/24V 系统）中作为开关或保护元件可行；但7.5Ω 的导通电阻较大，导通损耗在较高电流下显著。阈值电压约 2.4V，表明在逻辑电平下部分导通，但要获得较低 RDS(on) 需更高 Vgs（例如接近 10V 时）。较小的 Ciss/Crss 和 Qg 意味着在驱动能力有限的场合能够实现较快切换，适合频率不高的开关应用。
三、典型应用场景
- 低速数字开关、负载开关（小电流 LED 驱动、传感器供电切换）
- 电平转换与接口缓冲（3.3V 与更高电压间）
- 反向保护、极性保护与软启动电路（利用较高 Vdss）
- 模拟开关/开路检测（需注意导通电阻对信号的影响）
四、设计与使用注意事项
- 功耗与发热：按 P = I^2·RDS(on) 估算，若 Id = 300mA，P ≈ 0.3^2×7.5Ω = 0.675W，已远超 Pd = 0.35W，因此不能在无散热的 SOT-23 环境下长期承载 300mA；应限制平均电流、采用短脉冲或加强 PCB 散热。
- 栅极驱动：为降低开关损耗和 RDS(on)，尽量提高 Vgs（若系统允许接近 10V）；驱动源应能提供 Qg≈3nC 的瞬时电流，建议在门极串联 100Ω 左右限流并并联下拉电阻防止悬浮。
- 感性负载保护：开关感性负载时需外加续流二极管或 RC/Snubber，以防击穿或能量回灌。
- 布局建议：门极走线短且靠近驱动器，源端尽量与地平面良好连接以降低温升；对开关节点做去耦与吸收元件。
- 极性与引脚：SOT-23 常见引脚为 G、D、S（请参照厂方数据手册确认具体封装引脚定义）。
五、选型建议
若应用要求持续大电流或低 RDS(on)，建议选用低阻高流版本 MOSFET；若用于小电流、信号开关或电平转换，2N7002K 在 60V 耐压及小电容特性下是成本效益较高的选择。购买与设计前请以 JSMSEMI 的完整数据手册为准，核对温度系数、极限参数和封装尺寸，以保证可靠性。
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