WMSIC Electronic Components

JSMSEMI SMF8.0CA

ModelSMF8.0CA
PackageSOD-123FL
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI SMF8.0CA
Type
JSMSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
SMF8.0CA
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0264240615
Operating Temperature
55℃~+150℃
Voltage
13.6V
Current(Ir)
25uA
Voltage(VBR)
8.89V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF8.0CA 产品概述

一、产品概述

SMF8.0CA 是 JSMSEMI(杰盛微)推出的一款双向瞬态抑制二极管(TVS),专为低电压系统及 I/O 接口的浪涌与静电放电保护设计。器件在 SOD-123FL 小型封装下实现高达 200W 的峰值脉冲功率能力,能够在极短瞬时吸收突发过压能量,从而保护敏感电子元件不被损坏。

该器件反向截止电压(Vrwm)为 8V,击穿电压(VBR)为 8.89V,钳位电压(在峰值脉冲条件下)为 13.6V,峰值脉冲电流 Ipp 为 14.7A,典型反向漏电流 Ir 为 25µA,工作温度范围为 -55℃ 到 +150℃,适用于严苛环境下的长期可靠性要求。

二、主要参数

  • 极性:双向(Bidirectional)
  • 反向截止电压(Vrwm):8V
  • 击穿电压(VBR):8.89V
  • 钳位电压(Vclamp):13.6V
  • 峰值脉冲电流(Ipp):14.7A
  • 峰值脉冲功率(Ppp):200W
  • 反向漏电流(Ir):25µA
  • 工作温度:-55℃ ~ +150℃
  • 类型:TVS(瞬态电压抑制二极管)
  • 封装:SOD-123FL
  • 品牌:JSMSEMI(杰盛微)

三、关键特性与优势

  • 小封装大能量:SOD-123FL 封装便于空间受限的电路板设计,同时在峰值 200W 条件下仍能提供有效浪涌吸收能力。
  • 双向保护:支持正、负极性瞬变抑制,适合差分信号线、数据总线和双向电源轨保护。
  • 低钳位电压:在 14V 左右的钳位表现保证了对下游器件的有效保护,兼顾保护效果与系统容限。
  • 低漏电流:25µA 的典型反向漏电流可确保在休眠或低功耗系统中对电源影响最小。
  • 宽温度范围:-55℃ 至 +150℃ 的耐温性能,适应工业、汽车电子及室外设备等复杂工况。

四、典型应用

  • USB、HDMI、PCIe 等高速接口的浪涌与静电保护
  • 通信设备的 I/O 端口保护(如以太网线路、串口、CAN 总线)
  • 低压电源轨(5V、3.3V 等)瞬态抑制
  • 工业控制、仪表和传感器接口保护
  • 汽车电子辅助线路(在允许的应用范围内,需确认符合汽车级规范)

五、使用建议与设计要点

  • 布局靠近受保护端口:为获得最佳保护效果,建议将 TVS 尽量靠近受保护的连接器或信号入口处布局,减少走线感应和分布电阻。
  • 与阻抗匹配:在高速差分线或带宽敏感应用中,注意 TVS 的寄生电容对信号完整性的影响,必要时选用低电容型 TVS 或在 PCB 布局中采取差分对称设计。
  • 散热与功率分配:在频繁浪涌或高能量脉冲场景,应评估 PCB 散热和器件平均功耗,确保工作温度不超出额定范围。
  • 与熔断/限流元件配合:在需要更高能量承受能力时,可与保险丝或限流电阻配合使用,分担瞬态能量,延长器件寿命。
  • 检验环境与老化:长期暴露在高温高湿或盐雾环境下的应用,应在设计时考虑密封、防护涂层或定期检测计划。

六、封装与可靠性

SOD-123FL 为小型表面贴装封装,适合自动化贴片工艺,便于在高密度电路板上部署。器件的温度范围和漏电特性表明其具备良好的长期可靠性,但建议在关键应用场景下按 IEC 或行业相关标准进行 ESD、浪涌和温度循环测试验证。

七、选型与采购提示

  • 在选择 TVS 时,除 Vrwm、Vclamp 和 Ipp 外,还需关注器件的电容、封装兼容性与在目标应用下的可靠性测试结果。
  • 若需要更高峰值电流或更低钳位电压的保护,可考虑同系列的不同额定值或并联/组合方案,但并联时应注意匹配与热失配风险。
  • 采购时请注明品牌(JSMSEMI/杰盛微)、型号(SMF8.0CA)与封装(SOD-123FL),并确认器件批次与质量检验报告,以保证一致性与可追溯性。

如需针对具体电路的布板建议、等效寄生参数或信号完整性评估,我可以根据电路原理图和 PCB 布局进一步给出具体优化方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.