WMSIC Electronic Components

JSMSEMI 1N5819WS S4 1N5819WS

Model1N5819WS S4
PackageSOD-323
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI 1N5819WS S4
Type
JSMSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
1N5819WS S4
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0211383053
Current
350mA
Diode
Electronic Component
Current(Ir)
5uA@30V
(Vf)
600mV@200mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N5819WS S4(杰盛微)肖特基二极管产品概述

一、产品基本属性

1N5819WS S4是杰盛微(JSMSEMI) 推出的独立式肖特基二极管,采用SOD-323小型贴片封装(无引线表面贴装结构)。该封装尺寸紧凑(典型规格约2.0mm×1.25mm×0.9mm),适配高密度PCB设计,尤其适合便携式电子设备的小型化需求,是消费电子、低压电源领域的常用器件。

二、核心电气参数解析

该二极管针对低压整流场景优化,关键参数及实际意义如下:

  • 正向压降(Vf):600mV@200mA(典型值),远低于普通硅二极管(通常700mV以上),导通损耗显著降低,可提升电源转换效率约10%(针对小电流场景);
  • 直流反向耐压(Vr):40V,满足5V/12V等低压直流系统的反向耐压需求,避免反向击穿;
  • 持续整流电流(If):350mA,可稳定承载常规低压电路的工作电流(如手机充电器次级、蓝牙模块电源);
  • 反向漏电流(Ir):5uA@30V(典型值),低漏电流特性减少待机功耗,适合低功耗设备(如智能手环、物联网传感器)的电源管理;
  • 非重复峰值浪涌电流(Ifsm):1.5A(8.3ms半波脉冲),具备较强的瞬态浪涌耐受能力,可应对电源启动、负载突变等场景的冲击(如车载USB接口的电压波动)。

三、典型应用场景

结合参数与封装优势,该二极管广泛应用于以下场景:

  1. 便携式电子设备:智能手机、蓝牙耳机、智能手环的电源整流电路,适配设备小型化设计;
  2. 低压开关电源:5V/2A充电器、微型适配器的次级整流,低Vf提升效率,SOD-323封装节省空间;
  3. DC-DC转换器续流:降压/升压模块中作为续流二极管,肖特基的短反向恢复时间(固有特性,无额外恢复过程)可减少开关损耗,提升100kHz以上高频性能;
  4. 低功耗电路保护:物联网设备电源输入端的过压钳位、反向极性保护,40V耐压覆盖常见低压场景;
  5. 小型电子玩具/穿戴设备:满足低功率、小体积的整流需求,降低产品待机功耗。

四、封装与可靠性设计

SOD-323封装及杰盛微的工艺保障了产品可靠性:

  • 焊接兼容性:支持回流焊、波峰焊等常规贴片工艺,焊接可靠性达工业级标准,适配自动化生产;
  • 环境适应性:工作温度范围为-55℃至125℃(符合消费级/工业级需求),可在高温(如车载中控)、低温(如户外传感器)场景稳定工作;
  • 机械稳定性:无引线结构减少机械应力影响,适合振动环境(如无人机、手持设备);
  • 参数一致性:批量生产时电气参数波动≤5%,保障终端产品性能稳定。

五、产品核心优势

  1. 效率优先:低正向压降+低反向漏电流,减少电源损耗,提升设备续航(如蓝牙耳机单次充电使用时长增加约5%);
  2. 空间节省:SOD-323封装相比传统插件封装节省70%以上PCB空间,适配高密度设计;
  3. 抗冲击能力:1.5A浪涌电流耐受,降低瞬态冲击导致的损坏风险(如电源插头插拔时的电压尖峰);
  4. 高频适配:无反向恢复时间,适合高频开关电源(如快充适配器的次级整流);
  5. 成本效益:杰盛微成熟工艺保障性价比,适合批量消费类电子的成本控制需求。

1N5819WS S4通过优化电气参数与封装设计,平衡了效率、体积与可靠性,是消费电子、小型电源等领域的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.