WMSIC Electronic Components

JSMSEMI BTA41-600BRG BTA41

ModelBTA41-600BRG
PackageTO-3P
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI BTA41-600BRG
Type
TO-3P
Minimum package
30

Technical parameters

Electronic Component
JSMSEMI
Electronic Component
BTA41-600BRG
Electronic Component
1
Package
TOP-3
Electronic Component
Thyristor (SCR) / Module
Electronic Component
6.05g
Electronic Component
1
Electronic Component
BM0259722420
Operating Temperature
40℃~+125℃@(Tj)
Surge Current
400A@50Hz
Thyristor Type
1 Thyristor
Current(It)
40A
Electronic Component
30
Voltage(Vtm)
1.55V
Gate Voltage(Vgt)
1.3V
Gate Current(Igt)
50mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BTA41-600BRG 产品概述

一、产品简介

BTA41-600BRG 是一款双向导通的可控硅(双向可控硅 / TRIAC),由 JSMSEMI(杰盛微)提供,封装为 TOP-3。器件适用于交流电力控制场合,能够在正、负半周均实现门极触发与导通,适配各种交流负载控制需求。

二、主要电气参数

  • 可控硅类型:双向可控硅
  • 断态峰值电压 Vdrm:600 V
  • 通态峰值电压 Vtm:1.55 V(导通时的典型压降)
  • 通态电流 It:40 A(额定连续导通电流)
  • 浪涌电流:400 A @ 50 Hz(非重复峰值冲击能力)
  • 门极触发电压 Vgt:1.3 V(典型)
  • 门极触发电流 Igt:50 mA(典型)
  • 门极平均耗散功率 PG(AV):1 W
  • 工作结温范围:-40 ℃ ~ +125 ℃(Tj)

三、关键特性与优势

  • 高耐压:600 V 的断态峰值电压可满足中高压交流电源控制要求。
  • 大电流能力:40 A 的连续导通能力配合 400 A 的短时浪涌能力,可应对电机启动、加热器等大功率突变场景。
  • 门极触发要求低:Vgt≈1.3 V、Igt≈50 mA,触发驱动简单,便于使用微控制器或驱动电路直接驱动(视具体门极电阻而定)。
  • 包装可靠:TOP-3 封装利于安装与散热处理,适合需要外部散热器的设计。

四、典型应用场景

  • 灯光调光与家电调速(电机、风扇)
  • 电加热器、温控设备的功率调节
  • 固态继电器、交流开关模块
  • 工业交流负载的相位控制与无触点开关

五、设计与使用要点

  • 门极驱动:由于 Igt≈50 mA,驱动电路应能提供短时门极脉冲电流;若使用 5 V 驱动可计算门极串联电阻示例:R ≈ (5 V - 1.3 V) / 50 mA ≈ 74 Ω,以限制门极电流并保证可靠触发。
  • 抗误触发措施:在高 dV/dt 环境下需采取 RC 闪络(snubber)或并联抑制网络,以防止误导通。
  • 感性负载保护:对感性负载应考虑过电流、过压和逆变换引发的再触发问题,必要时加入缓冲电感或 RC 吸收回路。
  • 保护与熔断:设计中应配合合适的熔断器与过流保护策略,避免器件在异常工况下承受重复冲击超出规格。

六、热管理

器件在导通时存在约 1.55 V 的压降,导通电流越大损耗越显著(近似瞬时功耗 P ≈ I × Vtm)。例如在高电流瞬态时功耗会非常大,故必须配合有效散热片和良好热阻设计,保证结温不超过最大 Tj。TOP-3 封装便于通过底部或背板实现散热连接。

七、可靠性与注意事项

  • 门极平均耗散 PG(AV) 为 1 W,门极持续承受功率应控制在额定范围内,避免因门极过热导致失效。
  • 遵循冷焊/回流工艺规范,注意防静电与机械应力。
  • 在高温或长时间高负载工况下,定期评估结温与热循环对寿命的影响。

八、总结

BTA41-600BRG 是一款适合中高压交流功率控制的双向可控硅,具有较高的耐压与良好的浪涌承受能力,门极驱动需求低,适用于灯光调光、电机调速、加热控制等多种场景。设计中应重视门极驱动策略、抗 dv/dt 措施与热管理,以确保长期可靠运行。若需在特定应用中取得最优表现,建议结合负载特性进行具体的电路保护与散热设计验证。

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