WMSIC Electronic Components

JSMSEMI JSM6288Q

ModelJSM6288Q
PackageQFN-24
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 131959

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI JSM6288Q
Type
JSMSEMI
Minimum package
5000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
JSM6288Q
Electronic Component
1
Package
QFN-24
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
0.116g
Electronic Component
1
Electronic Component
BM0229961341
Operating Temperature
40℃~+125℃
Operating Voltage
8V~20V
Load Type
MOSFET
Current(IOH)
1.5A
Current(IOL)
1.8A
(tr)
30ns

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

JSM6288Q 产品概述

一、产品简介

JSM6288Q 是杰盛微(JSMSEMI)推出的一款高/低边三相信号驱动器,专为驱动功率 MOSFET 设计。工作电压范围宽(8V~20V),支持高边和低边驱动并可用于三相拓扑,适配工业和汽车级 12V/24V 系统。器件集成了欠压保护(UVP),静态电流低(Iq = 230µA),工作温度范围为 -40℃ 至 +125℃,封装为 QFN-24,便于在紧凑系统中实现高功率密度设计。

二、主要性能

  • 驱动配置:高边 / 低边 / 三相支持,灵活适配多种功率拓扑。
  • 驱动能力:拉电流 IOH = 1.5A,灌电流 IOL = 1.8A,可满足中大电流 MOSFET 的快速开关需求。
  • 开关速度:上升时间 tr ≈ 30ns,下降时间 tf ≈ 30ns(典型),适合高开关频率应用。
  • 工作电压:8V ~ 20V,覆盖 12V、24V 常见母线电压。
  • 保护与功耗:内置欠压保护(UVP),静态电流仅 230µA,有利于降低待机损耗。
  • 温度与封装:工业级温度范围 -40℃~+125℃,QFN-24 封装带热焊盘便于散热。

三、典型应用

  • 三相无刷直流电机(BLDC)驱动与伺服放大器。
  • 多相同步降(multi-phase buck)点对点供电(CPU/GPU供电子模块)。
  • 汽车电子电源管理、车载 DC-DC 转换与功率分配模块。
  • 大功率 LED 恒流驱动与工业电源开关模块。

四、设计与布局要点

  • 速率与栅电容关系:驱动电流决定 dV/dt,基本关系 dV/dt = Idrive / Cg;例如对 10nF 的等效栅电容,1.5A 驱动对应约 66.7ns 切换 10V,设计时需考虑 MOSFET 的 Qg。
  • 引导电路:高边驱动需配合引导电容与快速二极管实现 bootstrap 供电,保证高边 Vboot 在工作占空比下稳定。
  • 布局建议:驱动器 Vcc、Vboot 与电源地的退耦电容应靠近引脚放置;将功率回流路径(MOSFET 源极、回流电感)与控制地分离,使用单点接地或星形接地减少噪声耦合。
  • 门阻与阻尼:为控制振铃与开关损耗,可在栅极串联合适门阻 Rg;若系统对 EMI 敏感,可配合 RC 或 RCD 阻尼网络。

五、热管理与可靠性

QFN-24 带热焊盘,需在 PCB 下方布置足够的散热铜箔与过孔,将热量传导至多层板内层或散热片。在高占空比与高开关频率下,注意芯片结温不要超过额定范围,必要时采用外部散热或增加散热面积。器件工业级温度与低静态电流使其适合苛刻环境与长寿命应用。

六、封装与选型建议

JSM6288Q 的 QFN-24 小尺寸封装适合空间受限的功率模块。在选型时应确认所驱 MOSFET 的总门电荷 Qg 与关断电压匹配,评估驱动器的 1.5A/1.8A 源/吸能力能否满足目标开关速度与开关损耗要求。对高 EMI 或极端温度场景,建议与器件供应商确认绝对最大额定值与典型应用参考电路。

总结:JSM6288Q 提供高/低边三相驱动能力、快速开关性能与工业级可靠性,是面向中高功率 MOSFET 驱动应用的实用选择。

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