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JDTfuse ASMD1206-200 ASMD1206
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JDTfuse ASMD1206-200
- Type
- JDTFUSE
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JDTFUSE
- Electronic Component
- ASMD1206-200
- Electronic Component
- 1
- Electronic Component
- 1.9mm
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.042g
- Electronic Component
- 3.6mm
- Electronic Component
- 1.6mm
- Electronic Component
- 1
- Electronic Component
- 1.5s
- Electronic Component
- BM0264547821
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 800mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ASMD1206-200 产品概述
一、产品简介
ASMD1206-200 是集电通（JDTfuse）推出的一款 1206 封装表面贴装自恢复保险（PPTC）保护元件，专为低压直流系统的过流与短路防护设计。产品通过 UL 认证，质量稳定且具有良好的性价比，适用于消费电子、移动电源、USB 接口及各类便携式电源管理场景。
二、主要电气参数
- 最高耐压（Vmax）：6 V
- 最大允许浪涌电流（Imax）：100 A
- 保持电流（Ihold）：2 A（常温、参考条件下）
- 跳闸电流（Itrip）：3.5 A（典型）
- 功耗（Pd）：800 mW
- 初始态电阻（Rmin）：15 mΩ
- 跳断后电阻（R1max）：80 mΩ（恢复前）
- 动作时间：约 1.5 s（在指定过流条件下）
- 工作温度范围：-40 ℃ ~ +85 ℃
三、外形与封装
- 标准封装：1206 SMD
- 尺寸（长×宽×高）：3.6 mm × 1.9 mm × 1.6 mm
紧凑封装便于自动贴装与高密度 PCB 布局，适配常见贴片生产线和回流焊工艺。
四、主要特性与优势
- UL 认证，可靠性经过权威机构认可，便于产品认证合规。
- 自恢复设计：故障清除后可恢复导通，减少维护与更换成本。
- 高浪涌承受能力（Imax 100 A）：对瞬态短路与启动浪涌有良好承受性。
- 低初始电阻（15 mΩ 起）：在正常工作状态下引入的压降与功耗较小。
- 工艺稳定、性价比高，适合批量化产品应用。
五、典型应用场景
- 手机充电器、移动电源、平板与穿戴设备的电源保护。
- USB/Type-C 接口、车载充电器与小型电源模块的过流保护。
- 工业传感器、IoT 终端等低压供电系统的可靠防护。
六、使用建议
- 设计时应保证正常工作电流低于 Ihold，以避免误动作；短时浪涌应小于 Imax。
- 放置位置建议靠近电源输入端或受保护器件，以缩短保护响应路径并利于散热。
- 注意环境温度对保持电流与动作电流的影响，高温下需适当降额设计。
- 采用符合 1206 的焊盘与回流参数，避免过度热冲击影响可靠性。
七、可靠性与储运
- 工作温度范围宽，可满足多种环境条件。
- 储存与运输时避免潮湿与高温环境，贴片元件建议按常规电子元器件防潮控制（MSL）处理。
ASMD1206-200 以其小型化封装、良好浪涌承受能力和自恢复特性，为低压电源系统提供经济且可靠的过流保护解决方案。若需更详细的典型曲线、热特性及封装尺寸图，建议索取完整规格书（Datasheet）以便精准设计与验证。
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