Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JDTfuse ASMD0805-050 ASMD0805
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JDTfuse ASMD0805-050
- Type
- JDTFUSE
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JDTFUSE
- Electronic Component
- ASMD0805-050
- Electronic Component
- 1
- Electronic Component
- 1.5mm
- Package
- 0805
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.023g
- Electronic Component
- 2.3mm
- Electronic Component
- 1.1mm
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0264547837
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 500mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ASMD0805-050 产品概述
一、产品简介
ASMD0805-050 为 JDTfuse(集电通) 系列微型自恢复保险丝（0805 封装），适用于 6V 以下的过流保护场合。器件在过流时能在约 100ms 内动作断开，故障解除后可自动恢复，适合可重复保护需求的便携电子与接口电源防护。
二、主要电气参数
- 最大耐压（Vmax）：6V
- 最大电流（Imax）：100A（瞬态能力）
- 保持电流（Ihold）：500mA（长期不触发）
- 跳闸电流（Itrip）：1A（典型触发点）
- 动作时间：100ms（近似值，受环境与热耦合影响）
- 初始阻值（Rmin）：100mΩ
- 跳断后阻值（R1max）：850mΩ
- 功耗（Pd）：500mW（额定功耗）
三、机械与环境规格
- 封装：0805（表面贴装）
- 尺寸：2.3mm × 1.5mm × 1.1mm
- 工作温度：-40℃ ~ +85℃
- 通过 UL 认证，可靠性与安全性有保障
四、主要特点与优势
- 体积小、适配高密度 PCB 布局；0805 封装兼容常见贴片工艺（回流焊）
- 初始阻值低，正常工作时电压降小、发热低
- 自动复位，减少更换维护成本，适合不可频繁拆机的产品
- UL 认证，品质稳定，性价比高
五、典型应用
- USB、充电口过流保护（5V 系统）
- 移动电源、便携式设备的输入/输出保护
- 小电流传感器、控制模块的短路防护
- 工业与消费类产品的局部电源保护
六、选型与使用建议
- 保持电流 Ihold 应高于系统正常工作电流，建议余量 20%~50%；若工作电流接近 500mA，应选更高规格型号。
- 考虑实际热环境与 PCB 热耦合，实际动作电流与时间会有偏差，应以实测为准。
- 在高冲击电流场合（电机启动、浪涌）注意瞬态能力与热累积，必要时并联或选用更高 Ihold 型号。
- 回流焊工艺按器件数据手册推荐曲线执行，避免超过最大焊接温度导致性能下降。
七、认证与采购
ASMD0805-050 已通过 UL 认证，适用于对安全认证有要求的产品设计。由 JDTfuse(集电通) 品牌供应，量产交期与技术支持渠道完善。如需样品测试或批量采购，请提供应用场景与工作电流曲线，以便推荐最合适的规格。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
