WMSIC Electronic Components

JDTfuse ASMD0805-050-24V ASMD0805

ModelASMD0805-050-24V
Package0805
BrandJDTfuse
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JDTfuse ASMD0805-050-24V
Type
JDTFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JDTFUSE
Electronic Component
ASMD0805-050-24V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.026g
Electronic Component
2.2mm
Electronic Component
1.1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0264547823
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ASMD0805-050-24V 产品概述

一、产品简介

ASMD0805-050-24V 是集电通(JDTfuse)推出的一款0805封装表面贴装自恢复保险丝(Polymeric PTC resettable fuse),专为 24V 直流系统的过流保护设计。器件尺寸小巧(2.2×1.5×1.1 mm),响应速度快,品质稳定,性价比高,适合批量 SMT 贴装与自动化生产。

二、主要参数

  • 耐压(Vmax):24 V DC
  • 最大短时承受电流(Imax):100 A(短时冲击能力,非连续工作电流)
  • 保持电流(Ihold):0.5 A(500 mA)— 额定正常工作电流上限
  • 跳闸电流(Itrip):1.0 A — 在此电流下器件进入高阻态以限制电流
  • 消耗功率(Pd):0.5 W(500 mW)额定功耗
  • 初始态阻值(Rmin):0.10 Ω(100 mΩ)
  • 跳断后最大阻值(R1max):0.85 Ω(850 mΩ)
  • 动作时间:约 100 ms(典型值,受环境温度与电流上升率影响)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 尺寸:长度 2.2 mm × 宽度 1.5 mm × 高度 1.1 mm
  • 封装:0805(适用于标准 SMT 流程)

三、特性与优势

  • 小型化封装:0805 封装便于高密度电路板布置,节省空间。
  • 快速限流:约 100 ms 的动作时间能在过流时迅速将电流限制在安全范围,保护下游器件。
  • 低初始阻抗:初始阻值仅 100 mΩ,正常工作时功耗和压降小,降低发热。
  • 可复位保护:自恢复特性避免一次性熔断器频繁更换,提高系统维护效率。
  • 良好冲击承受:能承受短时高达 100 A 的浪涌冲击,适合含瞬态电流的负载场景。
  • 宽温度范围:-40 ℃ 至 +85 ℃,满足大多数商用与工业电子环境(但高温下特性会受影响,应按规格评估)。

四、典型应用

  • 24 V 工业控制与通信设备的输入保护
  • 消费类电子、路由器、机顶盒等电源前端过流保护
  • 电池保护与充电设备(符合电压范围要求)
  • PoE 支持设备(在额定条件内)与弱电系统保护
  • IoT 终端与嵌入式系统的微型保护单元

五、安装与使用建议

  • 采用标准 SMT 回流焊工艺,遵循制造商推荐的回流曲线,避免过高峰值温度与过长加热时间。
  • 设计 PCB 布局时为器件周边留出散热空间,若在高环境温度或靠近发热元件位置,应评估热耦合对动作电流的影响。
  • 在长期靠近额定 Ihold 工作时,建议验证实际温升与功耗(Pd=500 mW)以确保可靠性。
  • 若电路存在频繁或长期高于 Ihold 的条件,应考虑选择更大额定值的保护元件。

六、可靠性与品质保证

集电通(JDTfuse)对 ASMD0805-050-24V 的生产与测试流程有严格控制,器件经过电气特性、温度循环与焊接可靠性等检验,适合批量商业化生产应用。总体特点是品质稳定、性价比高,可为多类 24 V 直流系统提供可靠的过流保护解决方案。

如需样片、电气特性曲线(I-T、I-R)或 PCB 布局建议图,可提供进一步技术支持与资料。

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