Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JDTfuse ASMD1206-200-16V ASMD1206
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JDTfuse ASMD1206-200-16V
- Type
- JDTFUSE
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JDTFUSE
- Electronic Component
- ASMD1206-200-16V
- Electronic Component
- 1
- Electronic Component
- 1.9mm
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.053g
- Electronic Component
- 3.6mm
- Electronic Component
- 1.6mm
- Electronic Component
- 1
- Electronic Component
- 1.5s
- Electronic Component
- BM0264547831
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 16V
- Power(Pd)
- 800mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ASMD1206-200-16V 产品概述
一、产品简介
ASMD1206-200-16V 是集电通（JDTfuse）推出的一款高性价比表面贴装自恢复保险元件（复位式PTC/Polyfuse），封装为1206（3.6×1.9×1.6mm）。该器件针对低电压直流系统的过流保护需求设计，具备稳定的动作特性与良好的短时浪涌承受能力，适合消费电子、通信设备、电池保护等多种场景。
二、主要技术参数
- 额定耐压（Vmax）：16 V
- 最大电流（Imax）：100 A（短时浪涌能力）
- 保持电流（Ihold）：2 A
- 跳闸电流（Itrip）：3.5 A
- 功耗（Pd）：800 mW
- 初始态阻值（Rmin）：15 mΩ
- 跳断后最大阻值（R1max）：80 mΩ
- 动作时间：1.5 s（典型）
- 工作温度范围：-40 ℃ ~ +85 ℃
- 外形尺寸：3.6 mm × 1.9 mm × 1.6 mm（1206）
三、性能特点
- 品质稳定、性价比高：材料与工艺经过优化，批次一致性好，适合量产应用。
- 快速过流响应：在超过Itrip时能在标称动作时间内显著升阻，保护下游电路免受损害。
- 复位功能：异常消除后阻值恢复接近初始态，便于重复保护与维护。
- 低初始阻抗：Rmin 15 mΩ，正常工作时压降和功耗较小，适合较大电流的持续工作需求。
- 体积小、贴片封装：1206 封装方便SMT自动贴装与回流焊工艺。
四、典型应用场景
- USB、Type-C/PD 接口与外设供电过流保护（注意系统电压不超过16V）
- 移动电源、充电宝与便携式设备电源线路保护
- 电池管理系统（短路与异常放电保护）
- 通信设备、路由器、机顶盒等内部电源分路保护
- 工业与家用小型电子设备的局部过流保护
五、选型与使用建议
- 留有裕量：选型时建议保持Ihold至少大于实际工作电流的1.2~1.5倍，以避免误动作；若存在持续近Ihold的工作电流，应考虑更高规格器件。
- 考虑环境温度：高温会降低动作电流，应根据使用场景作温度系数调整或增加裕量。
- 浪涌能力：Imax 为短时浪涌能力，不代表可持续电流；如需频繁大电流启动，应评估器件寿命与热累积。
- PCB 布局与焊接：遵循1206封装的焊盘推荐尺寸，采用标准回流焊工艺；留意周围铜箔散热与热阻影响。
- 验证测试：量产前建议在目标系统上进行过流、温升与循环复位测试，验证实际动作与恢复特性。
六、包装与售后提示
品牌：JDTfuse（集电通）；封装：1206。常见供应形式为卷带包装，购买时请与供应商确认包装、交期与出货检验报告。对于关键应用，建议索取样品并进行可靠性测试，必要时确认是否有相关认证与长期供货支持。
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