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JDTfuse ASMD0805-075 ASMD0805
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JDTfuse ASMD0805-075
- Type
- JDTFUSE
- Minimum package
- 4000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JDTFUSE
- Electronic Component
- ASMD0805-075
- Electronic Component
- 1
- Electronic Component
- 1.5mm
- Package
- 0805
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.023g
- Electronic Component
- 2.3mm
- Electronic Component
- 1mm
- Electronic Component
- 1
- Electronic Component
- 200ms
- Electronic Component
- BM0265001235
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 600mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ASMD0805-075 产品概述
一、产品简介
ASMD0805-075 是集电通（JDTfuse）推出的一款高性价比 SMD 过流保护元件，采用 0805 封装，适用于空间受限的移动与消费类电子产品。该器件为自恢复型过流保护（PPTC）元件，能在过流或短路情况发生时限制电流并在条件恢复后自动复位，便于提高系统可靠性并降低维护成本。产品通过 UL 认证，品质稳定，适合量产使用。
二、主要参数
- 允许工作电压（Vmax）：6 V
- 最大极限电流（Imax）：100 A（短时浪涌能力）
- 保持电流（Ihold）：0.75 A（750 mA）
- 跳闸电流（Itrip）：1.5 A
- 功率耗散（Pd）：600 mW
- 初始态阻值（Rmin）：70 mΩ
- 跳断后最大阻值（R1max）：385 mΩ
- 动作时间：200 ms
- 工作温度范围：-40 ℃ ~ +85 ℃
- 尺寸：2.3 mm × 1.5 mm × 1.0 mm（0805）
三、特性与优势
- 封装小巧：0805 尺寸，便于高密度 PCB 布局与自动贴片工艺。
- 自恢复能力：过流后不会熔断，电路恢复后能自动恢复导通，降低更换频率。
- 快速动作：200 ms 动作响应，可有效抑制短时过流事件。
- 耐冲击电流强：短时承受高达 100 A 的浪涌电流，适合 USB、充电等含浪涌场景。
- 认证与稳定性：通过 UL 认证，品质稳定，适合量产与商业级应用。
- 成本效益高：与同类产品比较具有竞争力的价格与可靠性平衡。
四、典型应用
- 移动设备与便携式充电器（USB/Type-C 端口保护）
- 电源管理模块、隔离保护电路
- 可穿戴设备与消费类电子产品的板级过流保护
- 电池管理与电源输入防护（低压系统，≤6 V）
- 主板与外设接口短路保护
五、使用与选型建议
- 电压限制：本件适用于低压电路（最高 6 V），不可用于高压系统。
- 留有裕量：在常态工作电流接近 Ihold 时建议留有余量，避免在高环境温度下误触发。
- 浪涌考虑：Imax 为短时能力，设计时需结合实际浪涌幅值与持续时间评估。
- 布局与回流：遵循 0805 封装回流焊工艺规范，注意焊盘设计与热分布，避免过热影响特性。
- 环境与老化：工作温度范围 -40 ℃ 至 +85 ℃，长期高温会影响触发特性，需在可靠度评估中考虑温升。
六、可靠性与认证
ASMD0805-075 已获得 UL 认证，制造与测试流程符合工业规范。器件采用材料与工艺经过稳定性验证，适合大批量装配与长期使用。建议在产品开发阶段进行整机级过流与热仿真验证，以确保在目标应用环境下的可靠性表现。
如需样品、详细典型曲线（I-T、V-I）、封装尺寸图或推荐焊盘尺寸，可联系供应商或索取技术资料以便完成最终设计与验证。
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