Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JDTfuse JFC1032-2600FS JFC1032
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JDTfuse JFC1032-2600FS
- Type
- JDTFUSE
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JDTFUSE
- Electronic Component
- JFC1032-2600FS
- Electronic Component
- 1
- Electronic Component
- 3.2mm
- Package
- SMD,10.3x3.2mm
- Type
- SMD Fuse
- Electronic Component
- Non-Resettable Fuse
- Electronic Component
- 0.352g
- Electronic Component
- 10.25mm
- I2t
- 2285
- Electronic Component
- 1
- Electronic Component
- BM0265001264
- Operating Temperature
- 55℃~+125℃
- Voltage
- 250V
- Current
- 60A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
JFC1032-2600FS 产品概述
一、产品简介
JFC1032-2600FS 是集电通（JDTfuse）推出的一款贴片式大电流高耐压熔断器，封装为 SMD，外形尺寸约 10.3 × 3.2 mm（长度标称 10.25 mm，宽度 3.2 mm）。该器件设计用于在高电流和高工作电压环境下提供可靠过流保护，工作温度范围宽（-55℃ 至 +125℃），适合工业级及汽车电子等要求苛刻的应用场景。
二、主要技术参数
- 类型：贴片式保险丝（SMD）
- 额定电流：60 A
- 额定电压：250 V
- 工作温度：-55℃ ~ +125℃
- 熔断 I2t：2285（A²s）
- 封装尺寸：10.3 × 3.2 mm（标称长度 10.25 mm）
- 品牌：JDTfuse（集电通）
（注：熔断特性、时间-电流曲线及最大短路承受能力请参照厂家详细数据表确认。）
三、产品特性
- 高电流承载能力：60 A 额定电流，适合大电流主回路保护。
- 高耐压能力：最高额定电压 250 V，满足多数直流/交流电源系统的耐压要求。
- 宽温度适应性：-55℃ 至 +125℃ 的工作范围，适用于严苛环境。
- 能量吸收能力：熔断 I2t 为 2285 A²s，表征在过流事件中吸收的能量水平，有助于评估对被保护电路的冲击。
- 贴片封装：SMD 形态便于自动化贴装与回流焊接，适合高密度 PCB 设计。
四、典型应用场景
- 开关电源与逆变器的输入/输出回路保护
- 电池管理与保护（UPS、储能、电动工具等）
- 通信设备与服务器的电源模块
- 工业控制、伺服驱动、变频器等大电流电力电子设备
- 需兼顾高电压与高电流的电子系统保护场景
五、安装与使用注意事项
- PCB 设计：建议参考厂家推荐的焊盘尺寸与过孔布局，保证良好焊接与散热路径。
- 回流焊：可采用常规无铅回流工艺，但具体回流曲线请依据厂家数据表和工艺规范确定。
- 热管理：长期接近额定电流工作时需注意器件温升，必要时在附近提供散热或降低实际工作电流（退载）。
- 并联与替换：若需更高电流承载，可在确认热分布与熔断一致性后采用并联方案；更换型号时应同时匹配额定电流、I2t、工作电压及封装尺寸。
- 安全与检测：设计中应预留熔断后的故障诊断与更换方案，避免因熔断造成次生故障。
六、选型与替代建议
选择时应综合考虑额定电流、额定电压、熔断能量（I2t）、时间-电流特性、封装尺寸以及环境温度。若需要相似规格的替代件，优先选择同封装、相近 I2t 值和相同或更高耐压/电流等级的器件，并参考制造商的相容性说明。
七、包装与供货
JFC1032-2600FS 为 SMD 贴片器件，适用于自动贴装生产线。具体卷带包装、最小订购量、交期及认证信息（如有 UL、IEC 等）请向集电通（JDTfuse）或授权分销商咨询并索取完整版数据手册以获得详细技术与合规资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
