Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
kinghelm KH-TYPE-C-16P-T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- kinghelm KH-TYPE-C-16P-T
- Type
- KINGHELM
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- KINGHELM
- Electronic Component
- KH-TYPE-C-16P-T
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- USB Connector
- Electronic Component
- 0.43g
- (L)
- 7.6mm
- Electronic Component
- 1
- Electronic Component
- BM0264594933
- Electronic Component
- Electronic Component
- Operating Temperature
- 30℃~+80℃
- Electronic Component
- 1
- Electronic Component
- 1
- Electronic Component
- 16P
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KH-TYPE-C-16P-T Type-C卧贴母座产品概述
KH-TYPE-C-16P-T是金航标（kinghelm）针对低功耗小型电子设备设计的SMD卧贴式Type-C母座，兼顾紧凑结构、高可靠性与自动化生产适配性，是消费电子、智能家居等领域的实用型连接器解决方案。
一、产品定位与核心优势
该产品聚焦小型化设备的空间限制与低功耗场景的电流需求优化，核心优势体现在：
- 紧凑适配性：卧贴SMD封装无需额外垂直空间，可直接贴合PCB表面，适配超薄/小型设备内部布局；
- 全功能覆盖：16Pin触点遵循Type-C标准，支持信号传输与低功耗电源供电；
- 宽温可靠性：-30℃~+80℃工作范围，满足户外便携或工业环境的温度波动；
- 自动化友好：SMD封装支持回流焊工艺，适配自动化贴装线，提升生产效率。
二、关键参数与性能指标
严格遵循Type-C接口规范，核心参数如下：
参数类别 详细指标 连接器类型 Type-C母座（母端） 安装方式 卧贴（SMD表面贴装） 触点数量 16Pin（全功能Type-C配置） 端口数量 单端口（1个Type-C接口） 额定电流（电源） 500mA（低功耗场景适配） 工作温度范围 -30℃~+80℃ 电气性能 绝缘电阻≥100MΩ（DC500V）；接触电阻≤30mΩ 插拔寿命 ≥10000次（常规使用场景）注：信号引脚传输电流≤100mA，仅适配低功耗设备（不支持大功率快充）。
三、结构设计与工艺特点
- 耐高温壳体：采用LCP（液晶聚合物）材料，适配回流焊峰值温度（260℃±5℃），避免焊接变形；
- 触点工艺：信号/电源触点镀金（Au厚度≥0.3μm），提升抗腐蚀能力与接触稳定性；
- 正反插兼容：遵循Type-C正反插设计，无需区分插拔方向，提升用户便利性；
- 防呆结构：壳体内置防呆设计，避免PCB贴装方向错误，降低生产不良率。
四、典型应用场景
因低功耗适配性与紧凑结构，广泛应用于：
- 小型消费电子：蓝牙耳机充电盒、智能手环/手表、无线耳机充电仓；
- 便携式设备：小型移动电源（5V/1A以内）、便携蓝牙音箱、智能体温计；
- 智能家居：智能开关（低功耗控制）、传感器节点（温湿度/运动传感器）、小型遥控器；
- 工业辅助设备：小型监测终端（环境传感器）、低功耗控制器的接口。
五、安装与可靠性说明
- 安装工艺：仅支持SMD回流焊，不建议手工焊接；需匹配PCB焊盘尺寸（参考官方datasheet）；
- 可靠性测试：通过振动（10~2000Hz，10g）、冲击（100g，11ms）、盐雾（48h）测试，满足复杂环境需求；
- 维护注意：避免触点污染，可用无水乙醇擦拭，禁止尖锐工具刮擦。
KH-TYPE-C-16P-T以高性价比、紧凑设计与可靠性能，成为低功耗电子设备Type-C接口的优选方案，可满足大多数小型化产品的传输与充电需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
