WMSIC Electronic Components

LRC LBSS139LT1G

ModelLBSS139LT1G
PackageSOT-23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LBSS139LT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LBSS139LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.017g
Electronic Component
1
Electronic Component
BM0225823815
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
50V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LBSS139LT1G 产品概述

概要

LBSS139LT1G 是一款由乐山无线电(LRC)生产的场效应管(MOSFET),属于N沟道类型,封装在小型化的SOT-23封装中。这种MOSFET设计用于各种电子设备中的低功率开关和放大应用,特别适合需要高效能、低损耗和小尺寸的系统。

基础参数

以下是LBSS139LT1G的一些关键参数:

  • 功率(Pd): 225 mW
    • 这表明该MOSFET在正常工作条件下可以承受的最大功率。
  • 反向传输电容(Crss@Vds): 2.9 pF @ 25 V
    • 这个参数反映了在特定漏源电压下,反向传输电容的大小,对于高频应用非常重要。
  • 导通电阻(RDS(on)@Vgs, Id): 5.6 Ω @ 2.75 V, 200 mA
    • 这是指当门源电压为2.75V,漏极电流为200mA时,MOSFET的导通电阻。低导通电阻意味着更小的能量损耗和更高的效率。
  • 工作温度范围: -55℃ ~ +150℃
    • 这个广泛的温度范围使得LBSS139LT1G适用于各种环境和应用场景。
  • 漏源电压(Vdss): 50 V
    • 表示MOSFET可以承受的最大漏源电压,确保在正常工作条件下不会因过压而损坏。
  • 类型: 1个N沟道
    • N沟道MOSFET通常用于负载开关和放大应用。
  • 输入电容(Ciss@Vds): 22.8 pF @ 25 V
    • 输入电容影响MOSFET的开关速度和驱动需求。
  • 连续漏极电流(Id): 200 mA
    • 这是指MOSFET可以持续承受的最大漏极电流。
  • 阈值电压(Vgs(th)@Id): 500 mV @ 1.0 mA
    • 阈值电压决定了MOSFET开始导通所需的最小门源电压。

应用场景

LBSS139LT1G 的小尺寸和高性能使其适用于各种应用,包括但不限于:

  • 低功率开关电路: 由于其低导通电阻和小尺寸,LBSS139LT1G非常适合用于低功率开关应用,如LED驱动、传感器开关等。
  • 放大电路: 作为N沟道MOSFET,LBSS139LT1G可以用于小信号放大和中功率放大应用。
  • DC-DC转换器: 在一些简单的DC-DC转换器设计中,LBSS139LT1G可以作为开关元件。
  • 汽车电子: 由于其广泛的工作温度范围,LBSS139LT1G也可以用于汽车电子系统中。
  • 消费电子: 如手机、平板电脑等设备中的低功率控制和开关应用。

优势

  • 小尺寸封装: SOT-23封装使得LBSS139LT1G非常适合空间有限的设计。
  • 低导通电阻: 5.6Ω的导通电阻确保了低能量损耗和高效能。
  • 广泛工作温度范围: 从-55℃到+150℃的工作温度范围,使得该MOSFET可以在多种环境下稳定运行。
  • 高频性能: 低输入电容和反向传输电容使得LBSS139LT1G在高频应用中表现出色。

使用注意事项

  • 热设计: 尽管LBSS139LT1G具有225mW的功率等级,但在高频或高负载条件下,仍需要考虑散热问题。
  • 驱动要求: 由于阈值电压为500mV,需要确保驱动电路能够提供足够的门源电压以确保MOSFET完全导通。
  • 过流保护: 在设计中应考虑过流保护措施,以防止MOSFET因过流而损坏。

总之,LBSS139LT1G 是一款高性能、低功耗、体积小巧的N沟道MOSFET,广泛适用于各种低、中功率电子设备中的开关和放大应用。其优异的参数和小型化封装,使其成为现代电子设计中的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.