WMSIC Electronic Components

LRC LBSS84LT1G

ModelLBSS84LT1G
PackageSOT-23(SOT-23-3)
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LBSS84LT1G
Type
SOT-23(SOT-23-3)
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LBSS84LT1G
Electronic Component
1
Package
SOT-23(SOT-23-3)
Electronic Component
1 P
Type
P
Electronic Component
MOSFET
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM69415615
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
50V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LBSS84LT1G 产品概述

一、产品简介

LBSS84LT1G 是LRC(乐山无线电)生产的一款P沟道场效应管(MOSFET),其额定功率为225mW,额定电压为50V,额定电流为130mA。该产品采用SOT-23(SOT-23-3)封装,适用于各种电子电路中的开关控制和信号处理应用。LBSS84LT1G 是一款高效能、低功耗的MOSFET,能满足现代电子设备对高性能元件的要求。

二、产品特点

  1. 高效能:LBSS84LT1G 具备较低的导通电阻,能够实现高效率的开关控制,降低能量损耗,提升电路整体性能。

  2. 宽电压范围:其最大耐压达到50V,适用于多种电压环境中的应用,提供了良好的设计灵活性。

  3. 适中电流能力:LBSS84LT1G 的最大输出电流为130mA,满足了小型功率电子设备的需求,非常适合用于电子开关、负载控制等场景。

  4. 紧凑封装:采用SOT-23封装,不仅可以减小PCB面积,还方便在仪器和便携设备中的布局设计,适合高密度组装。

  5. 高可靠性:LRC作为知名电子元器件制造商,其产品一般具备良好的质量控制和稳定性,LBSS84LT1G 也不例外,适合长期使用。

三、技术参数

  • 类型: P沟道MOSFET
  • 最大耐压: 50V
  • 最大持续电流: 130mA
  • 功率耗散: 225mW
  • 封装形式: SOT-23 (SOT-23-3)
  • 工作温度范围: -55°C 至 +150°C

四、应用场景

LBSS84LT1G 可广泛应用于以下领域:

  1. 开关电源:在DC-DC转换器中作为开关元件,LBSS84LT1G 可以有效地控制输出电压和电流,提升电源转换效率。

  2. 负载控制:可以用于电机驱动、灯光控制等领域,作为电子开关部件,实现对通断的精确控制。

  3. 便携设备:由于其小巧的封装和较低的功耗,LBSS84LT1G 非常适合应用于智能手机、平板电脑等便携式电子设备中。

  4. 信号放大:利用MOSFET的高输入阻抗特性,LBSS84LT1G 可以在放大电路中作为增益元件,适用于音频信号处理等领域。

  5. 其他电子电路:由于其较为通用的特性,这款产品还可以在多种其他电子电路中实现控制和切换。

五、设计建议

在设计应用LBSS84LT1G 的电路时,需要注意以下几点:

  • 驱动电压:根据驱动电压选择合适的栅极电压,以确保MOSFET正常导通。

  • 散热设计:尽管该器件的功率较小,但在高频开关应用中仍需关注散热,避免过热导致损坏。

  • PCB布局:充分考虑PCB布线,尽量缩短源极、漏极和栅极的连线长度,以降低寄生电感和电阻。

  • 周边电路的兼容性:确保与该MOSFET相连的电路的电流和电压参数在可接受范围内,以避免损坏器件。

六、总结

LBSS84LT1G 是一款性能优良、应用广泛的P沟道MOSFET,其高效的导通性能及优异的散热能力使其成为现代电子设计的理想选择。凭借其小型化的SOT-23封装,LBSS84LT1G 可以有效适应各种设计要求,特别是在移动设备和电源管理应用中发挥重要作用。在选择元器件时,广泛的电压和电流范围的适用性,使得LBSS84LT1G 成为设计师的蓝图中不可或缺的一部分。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.