WMSIC Electronic Components

LRC LESD11D5.0CBT5G

ModelLESD11D5.0CBT5G
PackageDFN0603-DL
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LESD11D5.0CBT5G
Type
LRC
Minimum package
15000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LESD11D5.0CBT5G
Electronic Component
1
Package
DFN0603-DL
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.007g
Electronic Component
1
Cj- Capacitor
25pF
Electronic Component
BM0257399574
Voltage
8.4V;9.5V
Current(Ir)
100nA
Voltage(VBR)
8V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LESD11D5.0CBT5G 产品概述

一、概述

LESD11D5.0CBT5G 是乐山无线电(LRC)推出的一款小型低电容ESD保护二极管,封装为 DFN0603-DL。器件工作反向截止电压(Vrwm)为 5V,具有低漏电流和快速钳位响应,可在静电放电和瞬态过电压事件中对敏感电子接口提供有效保护。器件专为移动设备、接口口及高密度电路板的ESD防护设计。

二、主要电气参数

  • 反向截止电压 Vrwm:5V
  • 击穿电压 Vbr:8V(典型)
  • 钳位电压 Vc:9.5V(典型)
  • 峰值脉冲电流 Ipp:10A
  • 峰值脉冲功率 Ppp:85W(标准测试条件下的典型值)
  • 反向电流 Ir:100nA(在 Vrwm 条件下)
  • 结电容 Cj:25pF

这些参数表明该器件在保持较低结电容的同时,能承受较大的瞬态脉冲,且在工作电压下漏电小,适合对速度有一定要求且需可靠防护的信号线使用。

三、产品特点

  • 小型 DFN0603 封装,适合高密度贴片设计,降低占板面积。
  • 低结电容(25pF),对信号完整性影响小,适用于数据线或控制线防护。
  • 低漏电流(100nA),有利于节能应用与高阻抗电路的可靠工作。
  • 良好钳位性能(9.5V),在瞬态冲击下能将电压限制在可接受范围内。
  • 峰值脉冲能力强(Ipp 10A,Ppp 85W),提高系统对瞬态能量的承受能力。

四、典型应用场景

  • 手机、平板等消费电子设备的接口保护(充电口、耳机口等)。
  • USB、HDMI、MIPI 等外部数据接口的防护(视具体速率与电容需求选择)。
  • IoT 终端、穿戴设备的信号线与电源线瞬态抑制。
  • 工业电子、仪表等需要抗ESD与浪涌防护的低压电路。

五、使用建议

  • 建议将 LESD11D5.0CBT5G 放置在被保护接口靠近连线端,尽量靠近接地路径以缩短信号回路面积,优化钳位效果。
  • 在高速数据线应用时,务必评估结电容对信号眼图和时序的影响;25pF 适用于中低速信号线,高速差分信号请根据实际测试选择更低电容器件。
  • 焊接时遵循DFN封装的回流焊工艺规范,注意热剖面以保证焊点可靠性与器件性能。

六、封装与可靠性

器件为 DFN0603-DL 小型无引脚贴片封装,适配自动贴装与回流焊。LRC 提供常规的质量控制与可靠性测试,适用于商业级与工业级环境。具体的温度范围、回流温度曲线和环境可靠性测试数据建议参考厂商的详细规格书。

七、订购信息

产品型号:LESD11D5.0CBT5G
品牌:LRC(乐山无线电)
封装:DFN0603-DL
在选型与采购时,可联系供应商获取最小包装单位、库存与技术支持,或索取完整数据手册以便进行电路仿真与可靠性核查。

如需该器件的详细曲线图(I-V、钳位特性、结电容频率响应)或在特定应用中的评估建议,可提供目标电路参数,我可进一步协助选型与布局优化。

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