WMSIC Electronic Components

LRC LMBR01S30ST5G

ModelLMBR01S30ST5G
PackageX3-DFN0603
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LMBR01S30ST5G
Type
LRC
Minimum package
15000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LMBR01S30ST5G
Electronic Component
1
Package
X3-DFN0603
Electronic Component
Schottky Diode
Electronic Component
0.007g
Electronic Component
1
Electronic Component
BM0229475833
Current
100mA
Diode
1
Current(Ir)
10uA
(Vf)
300mV
Electronic Component
Electronic Component
Electronic Component
15000
Voltage Rating(Vr)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMBR01S30ST5G 产品概述

一、产品简介

LMBR01S30ST5G 是乐山无线电(LRC)推出的一款小型肖特基势垒二极管,专为便携式和高效率电源前端设计。该器件以超低正向压降和低反向漏电流为特点,配合微小 X3-DFN0603 封装,适合对体积、功耗和开关效率有严格要求的应用场景。

二、主要特性

  • 典型正向压降(Vf):0.30 V(低压降,降低整流损耗)
  • 直流反向耐压(Vr):30 V(适用于中低压整流与保护)
  • 最大整流电流:100 mA(连续工作能力)
  • 反向电流(Ir):10 μA(低漏电,适合待机/低功耗系统)
  • 非重复峰值浪涌电流(Ifsm):2 A(具备短时浪涌承受能力)
  • 品牌:LRC(乐山无线电)
  • 封装:X3-DFN0603(超小体积,适合高密度贴装)

三、电气参数与性能优势

LMBR01S30ST5G 以肖特基结的低势垒特性,实现了较低的正向压降,从而在整流与开关应用中显著降低功耗与发热。反向漏电流控制在微安级,使其在待机或低电流场合能保持较低的静态功耗。30 V 的反向耐压覆盖多数电源管理与保护应用需求,而 2 A 的峰值浪涌能力则保证了器件在瞬态冲击下的可靠性。

四、封装与热管理

X3-DFN0603 封装体积极小,利于在空间受限的产品中实现高密度布局。由于封装尺寸小,散热能力有限,建议在 PCB 设计时:

  • 为器件底部和引脚区域增加铜箔散热面积;
  • 采用热过孔或散热铜箔与大地/电源平面连接,以改善热阻;
  • 在连续接近最大整流电流工作时,评估结温并预留热裕度。

五、典型应用场景

  • 手持设备与可穿戴产品的电源整流和反向保护
  • 开关电源的输入/输出整流,尤其在低压差场合提升效率
  • 快速切换路径与取样回路的保护二极管
  • 电池供电系统的防反接与低损耗隔离
  • 任何对体积、功耗和开关速度有较高要求的小电流整流场合

六、典型电路与使用注意事项

  • 建议用于低压降整流或保护位置,避免在高散热要求下长时间满载工作。
  • 对于高峰值电流或频繁冲击场景,应评估 Ifsm 与热特性,并考虑并联或选择更高规格器件。
  • 在 PCB 布局时,信号线与散热铜箔应尽量靠近器件引脚,以减少寄生阻抗并提高散热效率。
  • 焊接建议遵循厂商回流焊温度曲线,避免过高温度或长时间保温,保护器件可靠性。

七、可靠性与质量保证

LRC 对此类封装与规格的器件在制造与测试环节有严格控制,常规会进行参数一致性测试与温度循环试验。为确保长期稳定性,建议在产品设计阶段参考器件数据手册的最大额定值与环境条件限制,并在样机阶段做实际工况下的老化测试。

八、选型与订购建议

对于需要在 30 V 以内、工作电流不超过 100 mA 且对低正向压降与低漏电有要求的应用,LMBR01S30ST5G 是体积与性能上均衡的选择。订购时请确认封装 X3-DFN0603 与批次一致,并向供应商索取最新的数据手册与器件曲线,以便完成热设计与可靠性评估。

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