WMSIC Electronic Components

LRC L2N7002KWT1G

ModelL2N7002KWT1G
PackageSC-70
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC L2N7002KWT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
L2N7002KWT1G
Electronic Component
1
Package
SC-70
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.027g
Electronic Component
1
Electronic Component
BM0229475832
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

L2N7002KWT1G 产品概述

一、主要参数

L2N7002KWT1G(乐山无线电 LRC 供应,封装:SC-70)为单个N沟道增强型场效应管,典型电气参数如下:

  • 漏源耐压 Vdss:60 V
  • 连续漏极电流 Id:380 mA
  • 导通电阻 RDS(on):2.7 Ω @ Vgs = 5 V
  • 功耗 Pd:300 mW
  • 阈值电压 Vgs(th):1.0 V @ Id=250 µA
  • 输入电容 Ciss:34 pF @ 25 V
  • 反向传输电容 Crss:2.2 pF @ 25 V
  • 工作温度范围:-55 ℃ 至 +150 ℃
  • 类型:N沟道,单个器件,SC-70 小封装

二、产品特点

  • 高耐压与逻辑驱动兼顾:60 V 的漏源耐压使其在较高电压边界的信号控制或保护电路中具备余量;Vgs(th)≈1 V,低门槛利于低压逻辑直接驱动。
  • 小封装、低寄生电容:SC-70 小型封装和 34 pF 的 Ciss、2.2 pF 的 Crss 有利于高速开关和减小附加负载,对空间受限的便携设备和高密度电路板非常适合。
  • 适中导通电阻与低功耗限制:在 5 V 门极驱动下 RDS(on)=2.7 Ω,为低电流信号开关与拉低路径提供可靠导通,但不适合大功率开关应用;300 mW 的耗散功率需注意散热与功耗管理。

三、典型应用场景

  • 逻辑电平转换、信号开关与缓冲:用于 SPI、I2C、GPIO 等接口的低电压互连与开关控制。
  • 低电流拉低或开关任务:驱动小继电器驱动电路的控制端、作为上拉/下拉开关或测试连接/断开器件。
  • 保护与隔离:作为防止反向电流或过压路径的控制元件(需配合限流/限压电路)。
  • 便携式与消费电子:适用于体积与能耗受限的便携设备、传感器模块、蓝牙/MCU 外围接口等。

四、封装与电路注意(简述)

  • 封装:SC-70 小型塑封,适合高密度贴装;焊接时注意回流温度曲线与湿敏等级。
  • 引脚处理:SC-70 管脚间距小,建议在 PCB 布局时为管脚和焊盘留出适当的焊盘扩展以保证可靠焊接。
  • 门极驱动:尽管阈值低,若需更低 RDS(on) 或更大导通电流,应考虑使用更高 Vgs(参考器件最大额定),但受 Pd 限制,须同步评估功耗。

五、布局与散热建议

  • 功耗与温升:器件 Pd=300 mW,连续工作时应保证环境温度和 PCB 散热条件使结温不超限。若在高占空比或高电流场合工作,建议加大铜箔散热区或使用过孔增加散热通道。
  • 降低开关干扰:对于高频开关场合,可在门极处并联小电阻或 RC 抑制网络以减小振铃与 EMI。利用接地平面和短回路路径可降低寄生感抗。

六、可靠性与选型提示

  • 使用温度范围广(-55 ℃ ~ +150 ℃),适应工业级环境。
  • 选型时需结合实际峰值电流、占空比和功耗预算:若应用中出现长期大电流或频繁开关,建议评估更低 RDS(on) 或更高 Pd 的替代型号。
  • 量产采购可参考乐山无线电(LRC)提供的相关物料编码与封装规格书,保证元件一致性与可追溯性。

总结:L2N7002KWT1G 是一款面向低电流开关和逻辑级控制的小型N沟道MOSFET,兼顾60 V耐压与低门槛驱动,适合空间受限的接口切换、信号控制与低功耗应用;在使用时需注意功耗与散热限制以确保长期可靠性。

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