WMSIC Electronic Components

LRC S-LM3Z10VT1G

ModelS-LM3Z10VT1G
PackageSOD-323
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-LM3Z10VT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
S-LM3Z10VT1G
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.025g
Electronic Component
1
(Zzt)
20Ω
Electronic Component
BM0228271664
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
200mW
Electronic Component
9.4V~10.6V
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S-LM3Z10VT1G 产品概述

一、主要特性

S-LM3Z10VT1G 为 LRC(乐山无线电)出品的独立式稳压二极管,标称稳压值 10V,实际稳压范围 9.4V ~ 10.6V。器件采用 SOD-323 小型表贴封装,适合空间受限的消费电子和通信终端。具有低反向漏电流、较低动态阻抗和良好的结温范围,适合用于低功耗稳压和基准电路。

二、典型电气参数

  • 标称稳压:10V
  • 稳压值范围:9.4V ~ 10.6V
  • 反向电流 Ir:100 nA(典型/最大级别)
  • 阻抗 Zzt:20 Ω(动态阻抗,有利于稳压精度)
  • 最大耗散功率 Pd:200 mW(@ 结温限制)
  • 工作结温范围:-65 ℃ ~ +150 ℃

三、封装与机械特性

封装:SOD-323(小型贴片封装),适合自动贴装与回流焊工艺。小尺寸有助于密集布板设计,但需注意散热受限,推荐合理布局以利散热。

四、热特性与可靠性

最大耗散功率 200 mW,在实际电路中应按结温与环境温度进行降额使用。按 Pd/Vz 估算,器件最大稳压电流在理论上 ~20 mA,但长期可靠运行应将工作电流控制在远低于最大耗散的范围内,并在高温环境下适当降额以延长寿命。

五、典型应用场景

  • 小功率基准电压源与微功耗稳压
  • 电源浪涌保护与电压钳位
  • 模拟电路偏置与参考电平生成
  • 手持设备、传感器节点、便携式仪器中的低功耗稳压需求

六、设计与使用建议

  • 串联限流电阻计算:R = (Vin - Vz) / Iz,建议选择使 Iz 在安全耗散范围内并兼顾负载调节能力。
  • 尽量避免长时间接近 Pd 上限运行,必要时在印制板上增加铜箔散热区。
  • 在高温或高电流瞬态下,注意稳压值会有漂移,设计时留有容差余量。
  • SOD-323 封装在回流焊工艺中对温度敏感,按厂家推荐工艺曲线焊接。

七、采购与封装信息

器件型号:S-LM3Z10VT1G
品牌:LRC(乐山无线电)
封装:SOD-323
适合在对体积、成本和功耗有要求的应用中作为可靠的小功率稳压器件选用。若需更详细的电气特性曲线或封装尺寸,请参照 LRC 官方数据手册。

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