WMSIC Electronic Components

LRC LBSS138DW1T1G

ModelLBSS138DW1T1G
PackageSC-88
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LBSS138DW1T1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LBSS138DW1T1G
Electronic Component
1
Package
SC-88
Electronic Component
2 N
Electronic Component
MOSFET
Electronic Component
0.027g
Electronic Component
1
Electronic Component
BM0229920545
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
50V
Capacitor(Ciss)
50pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LBSS138DW1T1G 产品概述

一、产品简介

LBSS138DW1T1G 是乐山无线电(LRC)推出的一款双通道 N 沟道增强型 MOSFET,封装为 SC-88(超小尺寸),面向低电流、低功耗与小体积应用。器件支持较宽的漏源电压(最高 50V),且在低栅压下可工作,适合便携设备、信号开关与电平移位等场景。

二、主要电气参数

  • 数量/类型:2 个 N 沟道 MOSFET(双通道)
  • 漏源电压 Vdss:50 V
  • 连续漏极电流 Id:200 mA(每通道)
  • 导通电阻 RDS(on):5.6 Ω @ Vgs = 2.75 V,Id = 200 mA
  • 耗散功率 Pd:225 mW(注意封装与散热条件)
  • 阈值电压 Vgs(th):0.5 V(典型)
  • 输入电容 Ciss:50 pF @ 25 V
  • 反向传输电容 Crss:5 pF @ 25 V
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装形式:SC-88(超小型表面封装)

三、性能与特点

  1. 低电压驱动:阈值电压约 0.5 V,可在较低栅压下触发,便于与低电平逻辑兼容。为达到标称 RDS(on) 建议驱动电压接近 2.75 V。
  2. 小体积、低电容:Ciss ≈ 50 pF、Crss ≈ 5 pF,有利于提高切换速度、降低驱动功率,适用于高频或快速开关场合。
  3. 双通道集成:在同一 SC-88 封装内集成两路 N 沟道晶体管,节省 PCB 面积,便于实现双路控制或差分应用。
  4. 宽电压耐受:50 V 的 Vdss 使其可用于较高工艺电压的场景(如汽车电子的低压外围和工业接口)。
  5. 低功耗器件:尽管 RDS(on) 相对较大(5.6 Ω),器件定位为小信号开关与控制用途,适合低电流工况。

四、典型应用场景

  • 低电流负载开关与功率路径控制(小型传感器、指示灯、继电器驱动的前端)
  • 电平移位与信号开关(I/O 保护、双向电平移位电路)
  • 电池供电便携设备的功耗管理与电源选择电路
  • 快速小信号切换、脉冲控制场合
  • 工业控制与仪表中对空间与成本敏感的接口电路

五、使用建议与热管理

  • 驱动电压:若需最小化导通损耗,请尽量使用 ≥2.75 V 的栅极驱动电压;在 1.5 V 左右仍可工作,但 RDS(on) 会显著增加。
  • 功率与温升:单通道 Pd 为 225 mW,SC-88 封装散热能力有限,长时间大电流工作需注意热路与环境温度,必要时考虑减载或并联(注意并联需匹配)及良好的 PCB 散热设计。
  • 工作电流建议控制在规格范围内(≤200 mA),并考虑在高温条件下对电流能力的降额处理。

六、封装与焊接注意事项

  • SC-88 为微小 SMD 封装,适合高密度布板,但对焊接工艺与回流曲线敏感。遵循制造商推荐的回流温度曲线以避免封装应力。
  • 该器件对静电敏感(ESD),在存储与装配过程中需采取防静电措施(佩戴防静电手环、使用防静电包装)。

七、选型参考

若设计需要在极小体积下实现双路低电流开关并兼顾较高耐压(50 V),LBSS138DW1T1G 是经济且实用的选择。对于需要更低导通电阻或更高连续电流的场合,应考虑更大封装或低 RDS(on) 型号。选型时应结合实际工作电流、驱动电压及散热条件进行权衡。

如需电气等效电路图、典型驱动电路或与其它器件并联/并用建议,我可提供进一步的原理图与布局要点。

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