WMSIC Electronic Components

LRC S-LN2308ELT1G

ModelS-LN2308ELT1G
PackageSOT-23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-LN2308ELT1G
Type
LRC
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
S-LN2308ELT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0230634265
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
900mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
312pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S-LN2308ELT1G 产品概述

一、主要参数

S-LN2308ELT1G 是乐山无线电(LRC)推出的一款 SOT-23 封装 N 沟增强型 MOSFET,适用于中低功率开关和保护场合。主要电气参数如下:

  • 漏源电压 Vdss:60 V
  • 连续漏极电流 Id:2.6 A
  • 导通电阻 RDS(on):100 mΩ @ Vgs=10 V, Id=2 A
  • 最大耗散功率 Pd:900 mW(环境及 PCB 条件相关)
  • 阈值电压 Vgs(th):2.5 V
  • 栅极电荷 Qg:3.3 nC @ Vgs=30 V
  • 输入电容 Ciss:312 pF @ Vds=30 V
  • 反向传输电容 Crss:16 pF @ Vds=30 V
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23

二、特性与优点

  • 60 V 的耐压等级使其可用于较高总线电压的开关应用。
  • 100 mΩ 的导通电阻(在 10 V 驱动下)在小功率负载时具有较低的导通损耗。
  • Qg=3.3 nC 和 Ciss=312 pF 表明栅极电容适中,驱动能耗和开关速度在小型驱动器或 MCU 驱动器配合下容易兼顾。
  • SOT-23 封装占板面积小,适合空间受限的应用与表贴组装。

三、典型应用

  • 小功率 DC-DC 变换器、降压/升压开关管
  • 负载开关、反接保护与电源选择电路
  • 小型电机驱动、继电器驱动与灯驱动(注意浪涌电流限制)
  • 电池管理与便携设备电源路径控制

四、封装与热管理

SOT-23 封装的热阻较大,Pd=900 mW 为理想散热条件下的值。实际应用中需注意:

  • 增大 PCB 铜箔面积并连接散热层以降低结温;长时间高电流工作需额外降额。
  • 在高环境温度下按厂商热特性曲线对功率和电流进行降额使用。

五、使用建议与注意事项

  • 虽然 Vgs(th)=2.5 V,但该值只是导通起始电压;若以低压逻辑(如 3.3 V)驱动,应验证在此驱动下 RDS(on) 是否满足系统损耗要求。
  • 对于感性负载,建议在开关回路添加合适的续流路径或外部二极管,并考虑 Crss 导致的米勒效应以避免误触发或开关振铃。
  • 建议在栅极串联小阻(10–100 Ω)以抑制振荡并限制瞬态电流,必要时并联 TVS 或 RC 吸收器以抑制电压尖峰。
  • 设计时确保持续电流和脉冲电流均在安全范围内,并在高温工况下按热降额计算。

六、选型与替代建议

本器件适合中低功率、60 V 级别的开关场合。若需更低 RDS(on) 或更高电流能力,应选用更大封装或专用功率 MOSFET;若需逻辑电平驱动(在 4.5 V 以下仍低 RDS(on)),应优先选择标注“逻辑栅”特性的型号。选型时同时比较 RDS(on) 在不同 Vgs 下的曲线、热阻以及开关损耗指标,以满足系统效率与可靠性要求。

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