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LRC LMUN5312DW1T1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LMUN5312DW1T1G
- Type
- LRC
- Minimum package
- 3000
Technical parameters
- Electronic Component
- LRC
- Electronic Component
- LMUN5312DW1T1G
- Electronic Component
- 1
- Package
- SOT-363
- Electronic Component
- 1 NPN, 1 PNP
- Electronic Component
- Digital Transistor
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0264584871
- Operating Temperature
- 55℃~+150℃
- Resistor
- 1
- Resistor
- 22kΩ
- Transistor Type
- NPN+PNP
- Power Dissipation(Pd)
- 250mW
- Electronic Component
- 3000
- Collector Current(Ic)
- 100mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LMUN5312DW1T1G 数字晶体管产品概述
一、产品基本定位
LMUN5312DW1T1G是乐山无线电（LRC）推出的PNP+NPN复合数字晶体管，专为小信号处理、逻辑电平转换及低功耗放大场景设计。产品整合双极性晶体管（PNP与NPN）于单一小型封装，兼具高集成度与稳定性能，满足消费电子、工业控制等领域的紧凑型电路需求。
二、核心电气参数详解
该产品的电气性能参数精准适配低功耗、小电流应用场景，关键指标如下：
- 耐压与电流能力：集射极击穿电压（Vceo）达50V，可承受中等电压应力；集电极最大电流（Ic）100mA，满足多数小信号电路的驱动需求；
- 功耗控制：最大耗散功率（Pd）250mW，支持连续工作于低功耗模式，避免过热风险；
- 增益与导通特性：直流电流增益（hFE）在5mA/10V条件下为60，保证信号放大线性度；集电极-发射极导通电压（VO(on)）仅200mV，导通损耗低，响应速度快；
- 电阻匹配：内置22kΩ输入电阻，电阻比率1:1，无需额外匹配电阻，简化电路设计；
- 温度适应性：工作温度范围覆盖-55℃至+150℃，符合工业级宽温要求，可在极端环境下稳定运行。
三、封装与可靠性设计
LMUN5312DW1T1G采用SOT-363封装（对应SC-88封装规格），这是一种超小型表面贴装封装，尺寸紧凑（典型尺寸约1.6mm×1.0mm×0.6mm），显著节省电路板空间，适合高密度集成设计。
封装设计兼顾散热与可靠性：
- 表面贴装结构适配自动化生产，焊接一致性好；
- 封装材料耐温性能与工作温度范围匹配，长期使用无老化失效风险；
- 引脚布局合理，减少信号串扰，提升电路稳定性。
四、典型应用场景
基于其PNP+NPN复合结构与小信号特性，LMUN5312DW1T1G广泛应用于以下场景：
- 逻辑电平转换：实现不同电压域（如3.3V与5V）之间的信号匹配，解决数字电路接口兼容性问题；
- 小信号放大：用于音频前置放大、传感器信号调理等低功耗放大场景，保证信号不失真；
- 开关控制：作为小功率开关管，驱动LED、微型继电器等负载，响应速度快，功耗低；
- 消费电子：如手机、平板的电源管理模块、按键电路、显示驱动辅助电路；
- 工业控制：PLC输入输出接口、传感器信号处理电路，适配户外或极端温度环境。
五、品牌与质量保障
该产品由国内知名半导体厂商乐山无线电（LRC） 生产，LRC在分立器件领域拥有数十年研发与制造经验，产品符合RoHS环保标准，通过AEC-Q101（汽车级）或工业级可靠性测试，质量稳定可靠。
产品型号后缀“DW1T1G”表明其为SOT-363封装、编带包装，适合大规模自动化生产，供货周期稳定，可满足批量应用需求。
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