WMSIC Electronic Components

LRC LESD8LVL5.0CT5G

ModelLESD8LVL5.0CT5G
PackageSOD-882
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LESD8LVL5.0CT5G
Type
LRC
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LESD8LVL5.0CT5G
Electronic Component
1
Package
SOD-882
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Cj- Capacitor
0.3pF
Electronic Component
BM0263676784
Voltage
12V;19V;16V
Current(Ir)
500pA
Voltage(VBR)
9V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LESD8LVL5.0CT5G ESD防静电二极管产品概述

乐山无线电(LRC)推出的LESD8LVL5.0CT5G是一款专为低电压敏感电子设备设计的低电容ESD(静电放电)保护二极管,针对高速信号线路及小型化终端设备的静电防护需求优化,兼具高防护性能与信号兼容性。

一、产品定位与核心设计目标

该器件聚焦低电压系统+高速信号+小型化封装三大核心场景,设计目标明确:

  1. 适配3.3V/5V等主流低电压供电电路,避免误触发;
  2. 低结电容保障高速数据传输的信号完整性;
  3. 小尺寸SOD-882封装满足便携设备的高密度PCB设计需求;
  4. 符合IEC 61000-4-2等国际ESD测试标准,提供可靠防护。

二、关键电气参数与应用价值解析

1. 反向截止电压(Vrwm=5V)

反向截止电压是器件正常工作时允许施加的最大反向偏置电压,5V的设计精准适配当前主流低电压系统(如3.3V MCU、5V USB供电),确保在设备正常工作电压范围内无反向导通,避免漏电流影响电路功能。

2. 击穿与钳位特性

  • 击穿电压(Vbr=9V):反向击穿的典型阈值,当ESD脉冲到来时,器件快速从截止态转为导通态,启动静电泄放通道;
  • 钳位电压(Vclamp=12V/19V/16V):对应不同ESD测试模型(如HBM、MM、CDM)的峰值电压,低钳位电压可有效抑制过压峰值,将后端敏感元件的电压限制在安全范围内,避免击穿损坏。

3. 脉冲耐受能力

  • 峰值脉冲电流(Ipp=4A):单次ESD脉冲可承受的最大峰值电流,覆盖IEC 61000-4-2中接触放电(±8kV)、空气放电(±15kV)的典型电流范围;
  • 峰值脉冲功率(Ppp=50W):脉冲能量耐受能力的核心指标,50W的功率可应对突发静电放电的能量冲击,保障长期可靠性。

4. 低功耗与高速信号兼容性

  • 反向漏电流(Ir=500pA):极低的漏电流几乎不影响低功耗系统的待机电流,适合智能穿戴、便携设备等电池供电场景;
  • 结电容(Cj=0.3pF):低结电容是高速信号防护的关键,可直接并联在USB 3.0、HDMI、LVDS等高速数据线上,避免信号衰减(如USB 3.0信号频率达5GHz,0.3pF电容的阻抗约100Ω,对信号影响可忽略)。

三、封装与物理特性

LESD8LVL5.0CT5G采用SOD-882表面贴装封装,物理尺寸约为1.0mm(长)×0.6mm(宽)×0.5mm(高),属于超小型封装,具备以下优势:

  1. 适合高密度PCB设计,可在狭小空间内实现多通道ESD防护;
  2. 无铅无卤工艺,符合RoHS 2.0环保标准,满足国际市场准入要求;
  3. 焊接可靠性高,可兼容回流焊、波峰焊等常规SMT工艺。

四、典型应用场景

该器件的参数特性使其在多领域具备广泛应用:

  1. 便携电子终端:智能手机、平板电脑、智能手表的USB接口、充电口、按键、音频接口等部位的ESD防护;
  2. 高速数据接口:笔记本电脑的HDMI、USB 3.0/3.1接口,显示器的LVDS/MIPI接口防护;
  3. 低功耗敏感电路:物联网传感器节点、蓝牙/WiFi模块、低功耗MCU的输入输出端口;
  4. 工业控制设备:小型PLC、传感器模块的模拟/数字输入端口,应对工业环境中的静电风险。

五、产品优势总结

与同类ESD二极管相比,LESD8LVL5.0CT5G的核心优势体现在:

  • 信号兼容性与防护性能平衡:低结电容(0.3pF)兼顾高速信号传输与可靠ESD防护;
  • 低功耗适配:500pA漏电流不影响电池供电设备的待机时间;
  • 小尺寸高密度:SOD-882封装满足便携设备的小型化设计;
  • 主流电压覆盖:5V反向截止电压适配3.3V/5V系统,应用场景广泛。

综上,LESD8LVL5.0CT5G是一款针对低电压高速系统优化的高性价比ESD防护器件,可有效提升电子设备的静电可靠性与信号完整性。

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