WMSIC Electronic Components

LRC LMSZ5232BT1G

ModelLMSZ5232BT1G
PackageSOD-123
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LMSZ5232BT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LMSZ5232BT1G
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.032g
Electronic Component
1
(Zzk)
1.6kΩ
(Zzt)
11Ω
Electronic Component
BM0227739077
Diode
1
Current(Ir)
5uA@3V
Power Dissipation(Pd)
500mW
Electronic Component
5.32V~5.88V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMSZ5232BT1G 产品概述

一、产品简介

LMSZ5232BT1G 是乐山无线电(LRC)推出的一款独立式稳压二极管(Zener diode),采用 SOD-123 表面贴装封装,专为小功率基准与稳压应用设计。器件标称稳压值为 5.6V,具有良好的温度与电流稳定性,适用于便携式设备与工业控制等场景的基准电压与浪涌钳位。

二、主要规格

  • 型号:LMSZ5232BT1G
  • 品牌:LRC(乐山无线电)
  • 封装:SOD-123(小型表面贴装)
  • 稳压值(标称):5.6V
  • 稳压值范围:5.32V ~ 5.88V
  • 反向电流 Ir:5 μA @ 3.0V
  • 功耗 Pd:500 mW(器件额定耗散功率)
  • 阻抗 Zzt:11 Ω
  • 阻抗 Zzk:1.6 kΩ
  • 工作结温范围:-55 ℃ ~ +150 ℃

三、电气特性与热特性

LMSZ5232BT1G 在反向工作区域提供稳定的基准电压。标称 5.6V 的稳压性能在推荐测试条件下表现可靠,Zzt=11 Ω 表明在测试电流下动态阻抗较小,有利于降低输出电压随电流变化的漂移;Zzk=1.6 kΩ 指示在低电流区的静态阻抗属性。器件最大耗散功率为 500 mW,实际电流设计应考虑结温与环境温度的降额,避免长时工作在极限功率下。工作结温范围宽(-55~+150 ℃),适应工业级温度要求。

四、典型应用场景

  • 稳压与参考电压源:为模拟电路、A/D 参考或小信号电路提供简易基准。
  • 过压/浪涌钳位:用于保护敏感电路免受瞬变过压。
  • 电源偏置与电平转换:在电源管理和信号接口处用作稳压元件。
  • 工业与消费类电子:适合空间受限、需表贴工艺的应用场合。

五、封装与可靠性

SOD-123 封装体积小、热阻适中,便于自动贴装和高速生产。为保证长期可靠性,建议在 PCB 设计中提供适当的散热路径(如铜箔面积)和足够的焊盘,并遵循回流焊工艺规范。器件耐高低温能力优良,可用于宽温度范围的产品设计。

六、选型与使用注意事项

  • 电流限流:稳压二极管工作时需并联负载并通过串联电阻限制电流,保证器件功耗 Pd 不被超过。
  • 温度降额:在高温环境下按制造商温度降额曲线设计,避免结温超过 150 ℃。
  • 小电流特性:当反向电流极小时,稳压值可能偏离标称范围,应用设计时应考虑 Zzk 等低电流阻抗特性。
  • 封装兼容:SOD-123 适用于贴片工艺,如需更高功率或不同封装,请参见同系列其他型号。

LMSZ5232BT1G 以其稳定的 5.6V 基准、电气性能和小型封装,适合空间受限且要求中低功率稳压的设计。选型时请结合实际电流/温度工况参照完整数据手册进行最终确认。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.