WMSIC Electronic Components

LRC S-LMBT5401LT1G

ModelS-LMBT5401LT1G
PackageSOT-23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC S-LMBT5401LT1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
S-LMBT5401LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0230025801
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
300MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S-LMBT5401LT1G PNP型双极晶体管产品概述

一、产品基本定位

S-LMBT5401LT1G是乐山无线电(LRC)推出的普通PNP型双极结型晶体管(BJT),采用SOT-23贴片封装,专为小型化、低功率电子设备中的信号放大与开关控制场景设计。其兼具高频特性、宽温度适应性与低损耗特点,是消费电子、工业控制等领域的常用基础器件。

二、核心电参数解析

该晶体管的关键参数明确了性能边界与适用场景,核心参数可分为三类:

(一)直流特性参数

  1. 集电极电流(Ic):最大连续集电极电流500mA,满足小功率电路的电流驱动需求;
  2. 集射极击穿电压(Vceo):基极开路时耐压150V,可应对中等电压场景(如电源辅助电路);
  3. 耗散功率(Pd):最大允许耗散300mW,适配低功耗设备(避免大功率场景);
  4. 直流电流增益(hFE):Vce=5V、Ic=10mA(典型小信号工况)下增益稳定240,确保信号放大线性度;
  5. 集电极截止电流(Icbo):仅50nA(典型值),漏电流极小,降低静态功耗;
  6. 集射极饱和电压(VCE(sat)):Ic=50mA、Ib=5mA(开关工况)下仅500mV,导通损耗低、开关响应快。

(二)高频特性

特征频率(fT)达300MHz,支持中等频率范围的信号处理(如音频、射频辅助电路),避免高频增益衰减过快。

(三)温度与电压稳定性

  • 工作温度:-55℃~+150℃,覆盖工业级要求,可在极端环境下稳定工作;
  • 射基极击穿电压(Vebo):5V,防止射基极过压损坏,提升电路防护性。

三、封装与可靠性设计

采用SOT-23贴片封装,具备三大优势:

  1. 小型化:体积紧凑(约2.9×1.6×1.1mm),适配智能手机、可穿戴设备等小型模块;
  2. 自动化生产:支持SMT贴装,适合大规模批量制造;
  3. 可靠性保障:LRC成熟封装工艺结合宽温设计,产品寿命长、故障率低。

四、典型应用场景

基于性能特点,该器件广泛用于:

  1. 小型信号放大:音频前置放大器、传感器信号调理(如温度/压力传感器);
  2. 低功率开关:小型家电电源开关、遥控器按键扫描电路;
  3. 电源辅助电路:线性稳压反馈回路、过流保护检测管;
  4. 消费电子模块:智能手机辅助控制、蓝牙耳机信号处理;
  5. 工业控制:PLC输入/输出接口、小型电机驱动辅助电路。

五、品牌与质量保障

乐山无线电(LRC)是国内半导体老牌厂商,产品符合RoHS、REACH等国际标准,S-LMBT5401LT1G经过温度循环、湿度老化等严格测试,一致性好,是替代进口同类型器件的高性价比选择。

该器件以均衡的性能覆盖了小功率电子设备的核心需求,是电路设计中常用的基础晶体管之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.