WMSIC Electronic Components

LRC SM360BF

ModelSM360BF
PackageSMB-FL
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC SM360BF
Type
LRC
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
SM360BF
Electronic Component
1
Package
SMB-FL
Electronic Component
Schottky Diode
Electronic Component
0.14g
Electronic Component
1
Electronic Component
BM0265452070
Current
3A
Diode
Electronic Component
Current(Ir)
10mA
(Vf)
700mV
Electronic Component
40℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SM360BF肖特基二极管产品概述

一、产品基本信息

SM360BF是乐山无线电(LRC) 推出的一款独立式肖特基二极管,属于表面贴装型低压整流器件。该型号针对中等功率、低压场景的整流/续流需求设计,采用SMB-FL封装,兼顾小型化与可靠性,广泛适配消费电子、工业电源等领域的电路设计,是LRC半导体产品线中经典的低压应用器件之一。

二、核心电性能参数

SM360BF的核心参数明确,可覆盖多数低压应用的核心需求:

  1. 正向压降(Vf):典型值700mV(0.7V),远低于普通硅整流二极管(通常1V以上),显著降低导通损耗,提升电源转换效率;
  2. 直流反向耐压(Vr):额定60V,可有效承受反向电压冲击,避免器件击穿,适合低压直流电路的反向防护;
  3. 整流电流(If):连续额定电流3A,可稳定承载中等功率的正向电流,满足多数小型电源的输出整流需求;
  4. 反向电流(Ir):额定10mA(通常指额定反向电压下的漏电流),漏电流控制在合理范围,确保反向截止时的功耗与稳定性;
  5. 配置类型:独立式(单管封装),无并联/串联结构,电路设计灵活,可根据需求自由组合。

三、封装与物理特性

SM360BF采用SMB-FL表面贴装封装,具有以下物理特性:

  • 小型化设计:符合SMB标准封装规格(典型尺寸约2.9mm×3.8mm×1.9mm),占用PCB空间极小,适配高密度贴装;
  • 贴装兼容性:支持自动化贴装设备,生产效率高,适合批量制造;
  • 散热优化:封装底部与引脚的热传导路径设计,配合肖特基低功耗特性,可有效散发明前向导通热量,避免局部过热;
  • 引脚可靠性:采用抗氧化材料,焊接性能良好,长期使用不易出现虚焊问题。

四、典型应用场景

结合参数与特性,SM360BF的典型应用包括:

  1. 低压开关电源整流:如手机充电器、笔记本适配器、小型LED驱动电源等,低Vf提升转换效率,3A电流满足中等功率输出;
  2. DC-DC转换器续流:在Buck/Buck-Boost电路中作为续流二极管,低正向压降减少续流损耗,提升输出精度;
  3. 极性保护电路:电池供电设备中防止反接损坏,60V反向耐压应对突发反向电压;
  4. 小型工业电源:PLC模块、传感器电源等低功率工业场景,稳定3A电流与可靠耐压满足工业级需求;
  5. 消费电子辅助电路:机顶盒、路由器电源模块,小型化封装适配设备内部紧凑空间。

五、产品优势与应用价值

SM360BF的核心优势体现在:

  1. 效率提升:低Vf(700mV)降低30%左右导通损耗,连续工作场景下节能效果明显;
  2. 功率适配:3A电流+60V耐压覆盖多数低压中等功率需求,无需额外降额设计;
  3. 可靠性保障:LRC严格可靠性测试(温度循环、湿度测试等),适合长期稳定工作;
  4. 设计灵活:独立式单管封装,可并联(提升电流)或串联(提升耐压),适配不同需求;
  5. 成本效益:小型化封装降低PCB成本,LRC量产能力确保供应稳定与性价比。

综上,SM360BF肖特基二极管凭借低损耗、高可靠性、小型化等特点,成为低压中等功率整流/续流场景的优选器件,广泛应用于消费电子、工业电源等领域。

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