WMSIC Electronic Components

LRC LBZT52C30T1G

ModelLBZT52C30T1G
PackageSOD-123
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LBZT52C30T1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LBZT52C30T1G
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.035g
Electronic Component
1
(Zzk)
300Ω
(Zzt)
80Ω
Electronic Component
BM0226539061
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
500mW
Electronic Component
28V~32V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LBZT52C30T1G 产品概述

一、产品简介

LBZT52C30T1G(品牌:LRC)是一款独立式稳压二极管,标称稳压值30V,允许工作稳压范围28V~32V,采用SOD-123小型封装。该器件适用于小功率基准与稳压、过压钳位和浪涌吸收等场合,体积小、便于表面贴装,适配自动化生产线。

二、主要电气与热特性

  • 稳压值(标称): 30V(典型工作区间 28V~32V)
  • 最大反向电流 Ir: 100 nA(反向漏电流极小,可在高阻抗电路中使用)
  • 动态阻抗: Zzk = 300 Ω(低电流/击穿前沿区域阻抗较高),Zzt = 80 Ω(稳态工作点下的动态阻抗更低,有利于维持稳压精度)
  • 最大耗散功率 Pd: 500 mW(器件在适宜散热条件下的最大耗散能力)
  • 工作结温范围: -55 ℃ ~ +150 ℃
  • 封装: SOD-123(表面贴装,体积小,适合高密度布局)

注:Zzk 与 Zzt 分别反映在不同偏流条件下的交流动态阻抗,Zzk 常对应低电流或击穿区过渡态,Zzt 为在推荐测试电流下的稳态阻抗。实际电路设计应参考器件在相应偏流下的阻抗特性以评估稳压性能。

三、典型应用场景

  • 小电流基准稳压:为模拟前端、测量电路或微控制器外设提供低成本参考电压(适用于电流受限的场合)。
  • 过压保护/钳位:在电源输入或信号线上实现限压保护,防止后级电路被瞬态高压损坏。
  • 浪涌/抑制辅助:配合限流元件用于吸收短时过压能量。
  • 电路试验与校准:作为易于替换的高压参考源,便于实验台与样机调试。

四、设计与使用建议

  • 串联限流:稳压二极管一般以并联(分流)方式工作,需在电源与二极管之间串联合适的限流电阻 Rs。Rs 可按下式初步计算:Rs = (Vin_min - Vz) / Iz_min(保证在最低输入电压下仍有足够的稳压电流);同时需确保在最高输入电压下,Iz_max 不会使器件超过 Pd:Iz_max ≤ Pd / Vz。
  • 功率与温升:标称 Pd=500 mW 是在特定散热条件下取得的最大耗散值。SOD-123 封装的散热能力有限,实际电路中应考虑 PCB 铜箔面积、过孔散热与环境温度,并做必要的降额使用。
  • 温度漂移:30V 左右的稳压通常处于雪崩区,温度系数可能为正或负(与具体工艺有关),长温度范围应用需在系统级验证实际温漂性能。
  • 漏电流影响:Ir 仅 100 nA,适合高阻抗测量回路,但在子微安级电流场合仍需考虑其影响。
  • 安装与焊接:SOD-123 封装兼容无铅回流工艺,推荐遵循焊膏与回流曲线规范以避免封装应力和热损伤。

五、封装与可靠性

SOD-123 为常用的表面贴装塑封,便于自动化贴装与回流焊接。器件设计工作结温范围宽(-55 ℃ 至 +150 ℃),适用于工业级环境。建议在高温或长期满功率工作时增加散热措施并进行温升测试,以确保长期可靠性。

六、选型要点与结论

选择 LBZT52C30T1G 时,应关注实际工作电流范围与功耗匹配:在保证稳压所需的最小偏流下保持稳压精度,同时在最大偏流下不超过 500 mW 的耗散限额。SOD-123 封装适合空间受限和中低功率应用,该型号由 LRC(乐山无线电)生产,适合做经济型高压稳压与保护用途。综合其小封装、低漏电、适中的稳压特性,是中小功率电子产品中常用的高压稳压解决方案。

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