Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC L9013QLT1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC L9013QLT1G
- Type
- LRC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- L9013QLT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0226525961
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Power Dissipation(Pd)
- 225mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 500mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
L9013QLT1G 产品概述
L9013QLT1G 是乐山无线电（LRC）推出的一款小功率NPN双极型晶体管，采用SOT-23封装，适用于便携式与通用电子电路中的开关与放大应用。器件在低电压、大电流工作点下具有较高直流电流增益与良好的开关特性，适合空间受限的表面贴装设计。
一、主要特性
- 晶体管类型：NPN
- 直流电流增益 (hFE)：150（测试条件 50mA, VCE≈1V）
- 最大集电极电流 (IC)：500mA
- 集电极–射极击穿电压 (VCEO)：20V
- 射极–基极击穿电压 (VEBO)：5V
- 集电极截止电流 (ICBO)：典型 150nA
- 集电极–射极饱和电压 VCE(sat)：典型 600mV（视驱动条件而定）
- 最大耗散功率 (Pd)：225mW（封装与环境条件相关）
- 工作温度范围：-55℃ ~ +150℃
- 封装形式：SOT-23（小体积、表贴）
二、电气性能摘要（要点）
L9013QLT1G 在中低电压（≤20V）及中等电流（≤500mA）范围内表现稳定。hFE 在 50mA 时约为 150，说明在小功率放大与驱动场合可提供较好的增益；但在饱和开关时实际有效放大倍数会下降，应按强制β估算基极电流。
三、封装与引脚提示
器件为 SOT-23 小封装，适合表面贴装加工与高密度PCB设计。不同厂家的引脚排列可能有所差异，建议在设计时参照 LRC 官方数据手册确认引脚定义（基极、集电极、射极位置）与布局。
四、典型应用场景
- 低压开关驱动（继电器、功率MOSFET栅极驱动、继电器线圈驱动等）
- 小信号放大器与音频前段
- LED 驱动与恒流控制（注意功耗限制）
- 电源管理与电平转换
- 便携设备、通信模块、家电控制电路
五、设计与使用注意事项
- Pd=225mW 为封装在规定环境下的最大耗散，实际使用须考虑PCB铜箔面积与散热条件，避免长时间在靠近极限功耗下工作。
- VCE(sat) 约 600mV 为典型值，开关损耗在大电流时不可忽视，必要时选用并联或更大功率器件。
- VEBO=5V 提示基极-射极间反向电压较低，避免在应用中直接对基极施加较高的反向电压。
- 在饱和开关时应按经验选择基极驱动（强制β通常取10~20），以保证低饱和压与稳定切换。
- 若在高温环境或连续大电流条件下工作，应评估结温并做好散热设计。
六、选型建议与替代
若系统工作电压接近或超过20V、或需要更高耗散/更低饱和压，应考虑额定电压与功率更高的器件。挑选时重点关注 VCEo、IC、Pd、VCE(sat) 与数据手册给出的温升特性。
七、总结
L9013QLT1G 是一款适合于低压中大电流开关与小功率放大的SOT-23封装NPN晶体管，具有较高的直流增益和宽温度范围，适合便携与空间受限的电子产品。在设计时应注意散热和基极驱动策略，并以LRC官方数据手册为准完成PCB布局与引脚连接。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
