WMSIC Electronic Components

LRC L2SC2412KQLT1G

ModelL2SC2412KQLT1G
PackageSOT-23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC L2SC2412KQLT1G
Type
LRC
Minimum package
3000

Technical parameters

Electronic Component
LRC
Electronic Component
L2SC2412KQLT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0264999488
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
180MHz
Power Dissipation(Pd)
200mW
Electronic Component
3000
Collector Current(Ic)
150mA
Current (h FE)
120

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

L2SC2412KQLT1G 产品概述

一、产品简介

L2SC2412KQLT1G 是乐山无线电(LRC)推出的一款通用 NPN 双极结型晶体管(BJT),采用 SOT-23 小封装,面向低功耗开关与小信号放大应用。器件支持最高集电极电流 150 mA、集射极击穿电压 50 V,特征频率 fT 达到 180 MHz,在体积受限和成本敏感的应用中表现稳定可靠。

二、主要特性

  • 晶体管类型:NPN,单只装(数量:1 个)。
  • 最大集电极电流(Ic):150 mA。
  • 集射极击穿电压(Vceo):50 V,适合中低压工作环境。
  • 耗散功率(Pd):200 mW,适用于低功耗设计与有限散热条件。
  • 直流电流增益(hFE):典型值 120,提供良好的放大能力和偏置稳定性。
  • 特征频率(fT):180 MHz,可胜任高于音频的射频/高频小信号放大。
  • 集电极截止电流(Icbo):100 nA,漏电小,有利于低静态功耗设计。
  • 集射极饱和电压(VCE(sat)):典型 400 mV,在做低压开关时损耗较小。
  • 射基极击穿电压(Vebo):7 V,注意基极反向电压限制。
  • 工作温度范围:-55 ℃ 至 +150 ℃,适应工业级温度需求。
  • 封装:SOT-23,便于表面贴装和自动化生产。

三、电气与应用要点

L2SC2412KQLT1G 在直流电流增益和频率响应之间取得良好平衡,hFE ≈ 120 使其在小信号放大器和前置放大级中能提供稳定增益;fT=180 MHz 则允许在几十兆赫兹范围内进行带宽设计。Ic=150 mA 与 VCE(sat)=400 mV 的组合,使其可用作小电流开关驱动或低功耗继电器/继电器式负载的驱动器,但需注意 Pd 仅 200 mW,持续开通时要评估功耗和 PCB 散热能力。

四、典型应用场景

  • 小信号放大器:无线前端、收发器本地放大、音频前级放大(低功耗场合)。
  • 低电压开关:逻辑电平驱动、继电器/小电机驱动(在保证功耗限制下)。
  • 频率转换与混频电路:因 fT 较高,适合中频放大与射频前级级联。
  • 通用放大与缓冲级:作为电流放大或电平移位器使用。
  • 工业与消费电子产品中的替换与设计优化。

五、封装与热管理建议

SOT-23 封装体积小,便于高密度 PCB 布局,但散热能力有限。建议:

  • 在器件下方与周围布置充足的铜箔以增加热扩散面积。
  • 对于持续导通或高频工作,应计算实际功耗(P = VCE × IC)并留出安全裕量,必要时限制占空比或加装散热结构。
  • 采用合理的贴片焊盘与短引线以降低热阻并提高可靠性。

六、使用注意事项

  • 避免基极反向超过 Vebo(7 V),以防损坏基极-射极结。
  • 在高温环境或靠近功率器件时注意 Pd 限制,防止热失效。
  • 设计开关电路时应考虑浪涌电流与瞬态,应加入限流或缓冲电路以保护器件。
  • 封装与针脚排列在不同生产批次或替代品间可能不同,实际设计前请参照最新版器件数据手册确认引脚图与典型特性曲线。

七、订购信息与包装

型号:L2SC2412KQLT1G
品牌:LRC(乐山无线电)
封装:SOT-23
数量:1 个(可按需求批量订购并选择卷带/盘装等包装形式)

如需在电路板上实现可靠运行,建议在样机阶段以真实工作条件做功耗与热仿真验证,并参照厂方完整数据手册查看典型测试条件与极限参数。若需要针对具体电路的偏置建议或原理图示例,可提供工作电源电压与负载条件,我方可给出更精准的设计指导。

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