WMSIC Electronic Components

LITEON LTST-E563CEGBW

ModelLTST-E563CEGBW
PackagePLCC-4
BrandLITEON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
LITEON LTST-E563CEGBW
Type
LITEON
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LITEON
Electronic Component
LTST-E563CEGBW
Electronic Component
1
Package
PLCC-4
Electronic Component
RGB LED(Built-in IC)
Electronic Component
0.062g
Electronic Component
1
Features
Built-in
Electronic Component
BM0263231815
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LTST-E563CEGBW 产品概述

一、产品简介

LTST-E563CEGBW 为 LITEON(台湾光宝)出品的表面贴装多色发光二极管(PLCC-4 封装),物理尺寸约 5 mm × 5 mm。器件内置单向传输功能(对各色通道提供方向保护与隔离),便于模块化驱动与可靠的颜色混合控制。该器件提供红、绿、蓝三色光源,典型波长分别为红 630 nm、绿 535 nm、蓝 475 nm,单色额定正向工作电流 If = 19 mA,光学发散角约 120°,适用于面光源、指示与显示等场景。

二、主要参数与规格

  • 封装:PLCC-4(SMD)
  • 尺寸:约 5 mm × 5 mm
  • 发光颜色与中心波长:红 630 nm / 绿 535 nm / 蓝 475 nm
  • 额定正向电流:19 mA(每色)
  • 视角(光束角):典型 120°
  • 功能特性:内置单向传输功能,通道隔离,便于并联或共用引脚的系统设计
  • 封装引脚:四引脚布局(详细引脚定义请参阅原厂数据手册)

注:以上为器件典型参数,具体电光特性(正向电压、光强、波长容差等)应以厂商数据手册中的曲线与典型/最小-最大值为准。

三、封装与机械特性

LTST-E563CEGBW 采用 PLCC-4 小型表贴封装,适合自动贴片与回流焊工艺。PLCC-4 的结构利于光学混色(RGB 三色在小体积内较好混合),同时便于在有限 PCB 面积上实现多色显示。器件四引脚间距与外形尺 寸需参照官方机械图纸进行 PCB 布局,确保良好锡膏印刷与焊接强度。

四、驱动与电路建议

  • 驱动方式:推荐恒流驱动或在每个通道上串联限流电阻的恒压驱动。若用于亮度控制或颜色混合,建议采用 PWM 调光,频率通常在几百 Hz 至几 kHz 之间以避免可见频闪。
  • 电气连接:利用内置单向传输功能可避免反向电流对相邻通道的影响,但仍需在系统设计时考虑共地/共电源排列与驱动器的承受能力。
  • 串联限流计算:R = (Vdrive - Vf) / If;红、绿、蓝的 Vf 不同,计算时需用对应通道的 Vf。
  • 保护措施:建议在电源上加入过压/过流保护及上电顺序控制;对高可靠性系统可在每通道并联 TVS 或限流器件。

五、焊接与热管理

  • 回流焊:遵循通用表面贴装器件回流曲线,峰值温度通常 ≤ 260 °C,回流高温滞留时间应尽量缩短(参考 J-STD-020)。具体回流曲线以厂商建议为准。
  • 热管理:尽管功耗较低,但持续高亮或高电流驱动时会产生热量,需保证 PCB 有足够的铜厚和散热路径,避免长时间高温运行导致光衰加速或颜色漂移。
  • ESD 防护:LED 对静电敏感,装配与测试过程中请采取静电防护措施(佩戴接地手环、使用导电垫、保持有效接地)。

六、应用场景与选型建议

  • 适用场景:多色指示灯、状态指示、面光源、小型背光、信号灯、消费电子与工业面板等需要 RGB 显示或颜色可调的场合。
  • 选型建议:若要求高亮度或需在较高电流下长期工作,应确认器件的最大连续电流和热阻参数;若需要更窄视角或更高显色性,考虑选用不同封装或单色高显色版本。

七、可靠性与检测建议

  • 建议在生产测试中进行光学一致性筛选(光通量、色坐标)与电气参数检测(If-I/V 曲线),对颜色均匀性和亮度进行 bin 分级以满足最终产品一致性需求。
  • 加速老化测试(HTOL)与温湿度循环(HAST、THB)可用于验证长期稳定性,尤其在户外或高湿度环境应用时。

八、订购信息与注意事项

  • 型号:LTST-E563CEGBW(请以 LITEON 官方命名与数据手册为准)
  • 采购时注意确认封装版本、色光 bin、出厂分选信息以及合格证书。
  • 在最终设计定稿前,务必索取并阅读 LITEON 的官方数据手册与机械图纸,以获取精确的引脚定义、尺寸、公差以及完整电光特性曲线。

如需该器件的详细电光参数曲线、典型正向电压与光输出数据或 PCB 封装推荐图,请提供需要的 bin 等级或告知我将为您查阅并整理相应技术资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.