WMSIC Electronic Components

LITEON LTV-8141S-TA1

ModelLTV-8141S-TA1
PackageSMD-4P
BrandLITEON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
LITEON LTV-8141S-TA1
Type
LITEON
Unit
Electronic Component
Minimum package
1000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
LITEON
Electronic Component
LTV-8141S-TA1
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.532g
Electronic Component
1
Electronic Component
53us
Electronic Component
BM0227695582
Operating Temperature
30℃~+100℃
Load Voltage
35V
Type
AC,DC
Output Current
80mA
Output Type
Photoelectric Transistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LTV-8141S-TA1 产品概述

一、产品简介

LTV-8141S-TA1 为 LITEON(台湾光宝)出品的单通道达林顿晶体管输出光耦合器,采用 SMD-4P 封装,适用于需要高隔离、较大输出电流增益的信号隔离场合。器件可接受 AC 与 DC 驱动,输入端为发光二极管,输出端为达林顿光电晶体管对,提供高电流传输比以实现小输入电流下的大输出驱动能力。器件额定工作温度范围为 -30℃ 至 +100℃,隔离耐压为 5 kVrms(典型值)。

二、主要参数

  • 隔离电压(Vrms):5 kV
  • 输入类型:AC、DC
  • 输出类型:光电三极管(达林顿结构)
  • 输出通道数:1
  • 电流传输比(CTR):最小 600%;上限/饱和值可达 7500%(典型范围受测试条件影响)
  • 正向压降(Vf):约 1.2 V(在标称 If 条件下)
  • 正向电流(If)最大值:50 mA
  • 最大输出电流:80 mA
  • 集射极饱和电压 VCE(sat):约 800 mV(条件:Ic=20 mA,If=20 mA)
  • 上升时间 tr:60 µs(测量条件:If=10 mA,负载 100 Ω)
  • 下降时间 tf:53 µs
  • 负载电压(最大):35 V
  • 总功耗 Pd:200 mW
  • 工作温度:-30℃ ~ +100℃

三、性能特性与使用要点

  • 高增益:达林顿结构赋予器件极高的电流放大能力(CTR 极高),适合用较小的 LED 驱动电流去驱动较大的负载电流。
  • 速度限制:达林顿输出使开关速度相对较慢(上升/下降时间几十微秒),不适合高频或精密模拟信号传输,适用于低速数字隔离与开关控制。
  • 驱动与保护:尽管 If 可达 50 mA,建议按数据手册的推荐值和占空比使用,并通过限流电阻或驱动电路控制瞬态脉冲以防 LED 损坏。对于 AC 驱动,应关注正反向电流与平均 If,可采用整流或适当驱动方案确保安全工作。
  • 热与功耗管理:总功耗 Pd 为 200 mW,输出端也应注意 VCE(sat) 与 Ic 带来的功耗,必要时在 PCB 布局上留出散热空间并进行功耗限流。
  • 安全隔离与 PCB 布局:器件 5 kVrms 隔离能力适合一般隔离需求,但在实际设计中仍需遵循爬电距离与工频冲击规范,确保满足目标系统的安全认证要求。

四、典型应用场景

  • 数字信号隔离:微控制器与高压或噪声侧之间的逻辑隔离。
  • 继电器/固态开关驱动前端:以较小 LED 驱动电流控制较大负载电流。
  • 工业控制与 PLC 输入/输出隔离:适用于低速开关、状态检测与指示信号传输。
  • 家电与电源监测信号隔离:对交流零火线状态检测等场合有良好适配性。

如需完整引脚定义、封装尺寸、典型电路图或详细的环境/可靠性测试数据,请参考 LITEON 原厂数据手册以获得精确的测量条件与推荐使用规范。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.