WMSIC Electronic Components

Leiditech SESD0402X1BN-0010-098

ModelSESD0402X1BN-0010-098
PackageDFN1006-2
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
Leiditech SESD0402X1BN-0010-098
Type
LEIDITECH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
SESD0402X1BN-0010-098
Electronic Component
1
Package
DFN1006-2
Electronic Component
0.01g
Electronic Component
1
Electronic Component
BM0265793029
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SESD0402X1BN-0010-098 ESD防护器件产品概述

一、产品定位与核心价值

SESD0402X1BN-0010-098是雷卯电子(Leiditech)推出的单通道低电容ESD防护器件,核心定位是为低电压高速信号系统提供「防护性能与信号完整性平衡」的静电及浪涌防护方案。其设计针对小型化、高速传输的电子设备,在满足电磁兼容(EMC)标准的前提下,尽可能降低对信号传输的干扰,同时适配紧凑的硬件布局需求。

二、关键参数与性能特点

该器件的核心参数围绕「低干扰、强防护、小尺寸」三大方向设计,具体如下:

2.1 电气性能参数

  • 截止/击穿特性:反向截止电压(Vrwm)=5V,适配5V及以下低电压系统(如消费电子、IoT设备);击穿电压(Vbr)=6V,高于截止电压,确保正常工作时器件反向截止,不影响系统电路;反向漏电流(Ir)仅500nA,极小漏电流不会额外增加系统功耗,适合对功耗敏感的可穿戴、电池供电设备。
  • 脉冲防护能力:峰值脉冲功率(Ppp)=110W(测试波形8/20μs),可承受典型ESD、EFT及浪涌脉冲;钳位电压(Vc)=23V,遭遇瞬态过压时快速导通,将电压钳位在23V以下,保护后端敏感器件(MCU、传感器、射频芯片等)。
  • 信号完整性:结电容(Cj)=0.22pF,属于超低结电容设计——结电容越低,高频信号衰减越小,可支持USB 3.2、HDMI 2.0、1Gbps/10Gbps以太网等高速信号传输,避免信号延迟或失真。

2.2 封装与物理特性

采用DFN1006封装(尺寸约1.0mm×0.6mm×0.4mm),超小型无引脚设计:

  • 节省PCB空间,适配智能手机、智能手表等紧凑设备;
  • 降低寄生电感,进一步提升高频信号传输性能。

三、防护标准与兼容性

该器件通过多项国际EMC标准认证,覆盖常见瞬态干扰场景:

  • IEC 61000-4-2(ESD):满足静电放电防护,应对接触放电(典型±8kV)、空气放电(典型±15kV),避免人体/设备间静电损坏;
  • IEC 61000-4-4(EFT):兼容电快速瞬变脉冲群,承受典型4kV/5kHz脉冲群冲击,适合工业强电磁干扰环境;
  • IEC 61000-4-5(浪涌):支持电源/信号线路浪涌防护(如雷击感应、开关浪涌),提升设备可靠性。

四、典型应用场景

结合参数特点,该器件适用于以下场景:

  1. 消费电子:智能手机、平板电脑的USB Type-C接口、HDMI端口、音频/视频输出;
  2. 可穿戴设备:智能手表/手环的传感器接口(心率/血氧)、蓝牙/WiFi模块、充电触点;
  3. IoT设备:智能家居节点(智能门锁、温湿度传感器)、工业网关的RS485/RS232接口;
  4. 通信设备:路由器/交换机的1Gbps/10Gbps以太网接口、射频前端(RF)信号输入;
  5. 工业控制:PLC数字I/O端口、低电压传感器信号采集电路。

五、应用优势总结

SESD0402X1BN-0010-098的核心优势可归纳为三点:

  • 高速信号兼容:0.22pF超低结电容,不影响1Gbps以上高速传输;
  • 小尺寸适配:DFN1006封装满足小型化设备的PCB布局需求;
  • 全场景防护:覆盖ESD、EFT、浪涌三类瞬态干扰,降低系统EMC设计风险。

该器件为低电压高速系统提供了「高防护+低干扰+小体积」的一体化解决方案,适合对信号完整性和空间有严格要求的电子设备设计。

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