WMSIC Electronic Components

Leiditech DSK34L

ModelDSK34L
PackageSOD-123FL
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech DSK34L
Type
LEIDITECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
DSK34L
Electronic Component
1
Package
SOD-123FL
Electronic Component
Schottky Diode
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0257609347
Current
3A
Diode
1
Current(Ir)
200uA@40V
(Vf)
420mV@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DSK34L 产品概述

DSK34L 是 Leiditech(雷卯电子)推出的一款小体积肖特基整流二极管,封装为 SOD-123FL。该器件在中低压、高电流场合提供低正向压降与快速切换特性,适合在开关电源、降压整流、续流和反向保护等应用中替代普通整流二极管以降低导通损耗与热量产生。

一、主要技术参数(基准条件)

  • 器件类型:肖特基整流二极管
  • 型号:DSK34L(品牌:Leiditech / 雷卯电子)
  • 正向压降 Vf:420 mV @ IF = 3 A
  • 额定直流整流电流 IF(AV):3 A
  • 反向耐压 VRRM:40 V
  • 反向漏电流 Ir:200 μA @ VR = 40 V
  • 非重复峰值浪涌电流 Ifsm:60 A(一次性脉冲)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-123FL(小型表面贴装封装)

二、性能特点与优势

  • 低正向压降:Vf = 0.42 V(3 A)明显低于普通硅整流器,在高电流工况下可显著降低导通功耗,提升转换效率并减小热耗散。
  • 快速切换与接近零反向恢复:肖特基结固有低反向恢复特性,适合高频开关应用,可减少开关损耗与电磁干扰。
  • 小型封装:SOD-123FL 占板面积小,适合密集布局的开关电源或移动设备电源管理。
  • 合理的浪涌能力:60 A 的非重复峰值浪涌电流可应对启动瞬态或短时冲击,但不替代须长期承受高脉冲能量的专用管。
  • 宽工作温度:-55~+150 ℃ 的结温范围满足工业级及部分严苛环境工作需求。

三、典型应用场景

  • 开关电源(SMPS)输出整流或续流二极管(尤其在同步整流不适用或成本/布局考虑下)
  • 低压大电流降压模块(Point-of-Load)输出侧整流
  • 电池充放电回路与电源反向保护(二极管正向导通阻止反向电流)
  • 太阳能小功率逆变器、DC-DC 升/降压模块的续流与保护电路
  • 汽车电子中 12 V/24 V 较低压段的整流与钳位(注意汽车特殊浪涌与瞬态要求,使用前需做系统验证)

四、热管理与可靠性建议

  • 虽然器件额定 3 A 连续整流电流,但实际可持续电流受焊盘铜厚、PCB热阻、环境温度及散热方式影响;设计时应根据系统热阻、允许结温与实际功耗做热仿真或实验验证并适当降额使用。
  • 反向漏电流会随温度上升而迅速增加;在高温工况(如靠近 +125 ℃)需评估漏电对系统待机功耗与功能的影响。
  • 对于高脉冲能量场合,浪涌能力应与系统脉冲波形匹配,若存在重复或长时间高幅脉冲,应采用更高规格器件或并联/增加能量吸收元件。
  • PCB 布局应增大焊盘与散热铜箔面积,使用热 vias 将热量向内部层或底层扩散,避免器件局部过热。

五、封装与焊接注意事项

  • SOD-123FL 为小型薄型贴片封装,适合普通 SMD 回流工艺。
  • 焊接建议使用制造商提供的回流曲线(无铅回流峰值温度通常 ≤ 260 ℃),并控制预热及冷却速率以避免封装应力。
  • 贴装时注意极性识别与焊盘设计,保证良好焊点和热连接。

六、选型与使用建议

  • 若系统电压 ≤ 40 V、工作电流接近几安培且希望降低导通损耗,DSK34L 是性价比较高的选择。
  • 在需要更低漏电或更高反向耐压的应用中,请考虑更高 Vr 或更低 Ir 的型号。
  • 系统设计阶段应做功耗、温升与长期可靠性测试,尤其关注高温下的漏电和结温上升对寿命的影响。
  • 订购时确认批次与标记,并在量产前索取完整的器件规格书与封装尺寸图以便生成 PCB 库与生产文件。

以上为 DSK34L 的产品概述与实用建议,具体电气参数的典型曲线、热阻和封装外形请参考雷卯电子提供的完整数据手册以获得详细的设计依据。

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