WMSIC Electronic Components

Leiditech TESD05FB

ModelTESD05FB
PackageSOD-323
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech TESD05FB
Type
LEIDITECH
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
TESD05FB
Electronic Component
1
Package
SOD-323
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.03g
Electronic Component
1
Cj- Capacitor
110pF
Electronic Component
BM0264887106
Voltage
13V
Electronic Component
IEC 61000-4-4;IEC 61000-4-5;IEC 61000-4-2
Current(Ir)
100nA
Voltage(VBR)
8V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TESD05FB 产品概述

一、产品简介

TESD05FB 是 Leiditech(雷卯电子)推出的一款面向5V工作电压系统的瞬态电压抑制(TVS)/ESD保护元件,采用 SOD-323 小封装设计,专为保护 USB 电源与数据线、机顶盒、数字电视等消费电子设备的输入/输出接口免受静电放电(ESD)、电快速瞬变(EFT)和感应雷击脉冲(浪涌)等瞬态过压干扰而设计。器件在极小封装下实现高能量吸收能力和低漏电,适用于空间受限的表贴应用。

二、主要参数(典型值)

  • 反向截止电压(Vrwm / 工作电压):5 V
  • 击穿电压(VBR):约 8 V
  • 钳位电压(Vc):约 13 V(受脉冲条件及测试电流影响)
  • 峰值脉冲功率(Ppp):315 W @ 8/20 µs
  • 峰值脉冲电流(Ipp):25 A(8/20 µs,浪涌)
  • EFT 能力:40 A(5/50 ns)
  • 抗静电等级:IEC 61000-4-2 空气/接触放电 ±30 kV
  • 反向电流(Ir):100 nA(在 Vrwm 条件下)
  • 结电容(Cj):约 110 pF
  • 类型:ESD/TVS 二极管
  • 封装:SOD-323(小型表贴)

三、主要特性与优势

  • 超低泄漏:典型反向漏电仅为 nA 级(100 nA 量级),适合对静态功耗敏感的便携式设备。
  • 强抗瞬态干扰能力:符合 IEC 61000-4-2 / -4 / -5 标准,能承受 ±30 kV ESD、40 A EFT(5/50 ns)、25 A 浪涌(8/20 µs)。
  • 低钳位电压:在大多数保护条件下钳位电压维持在约 13 V,能有效限制被保护电路上的过压峰值。
  • 小尺寸封装:SOD-323 适合高密度 PCB 设计,便于靠近连接器布置,缩短传导路径以提高保护效果。
  • 宽应用范围:适用于 USB 电源线路、低速数据线以及机顶盒、数字电视等消费类终端的接口保护。

四、典型应用场景

  • USB 2.0 电源(VBUS)与低速/电源相关数据线保护
  • 机顶盒、数字电视、机房设备的前端接口与外部连线保护
  • 手持设备、家庭网关等需要 IEC ESD/浪涌保护的输入端口
  • 其他需要 5 V 工作电压下抗静电和浪涌保护的低功耗电路

注:器件结电容约 110 pF,适合电源线或对信号带宽要求不高的保护场景;对高速差分信号(如 USB 2.0 高速 480 Mbps)可能产生信号完整性影响,详见下文设计建议。

五、设计与布局建议

  • 靠近受保护接口放置:为获得最佳 ESD 流向与最短回路,建议将 TESD05FB 贴近 USB/连接器金属外壳或信号引脚放置。
  • 对高速信号的适配:该器件的结电容 ~110 pF,对 USB2.0 高速(480 Mbps)差分线会显著影响信号完整性。建议将 TESD05FB 用于 VBUS(电源)或USB充电/低速线路;若用于高速数据线,应优先选择低电容(通常 < 5–20 pF)专用高速 TVS 器件。
  • 串联阻抗与滤波:在电源线上可配合小电感或阻容滤波网络使用,以共同抑制高频干扰并减轻对正常信号的影响。
  • PCB 接地处理:保护器的回流路径应尽量短且直接接地,避免长回流路径引起寄生感抗,影响保护效果;优先采用多层板的接地平面。
  • 热与功率能力:虽能承受瞬态大功率脉冲(315 W @8/20µs),但请避免反复、长时间的大能量冲击;为可靠运行,按厂方推荐的应用条件选型并保证合理散热与浪涌缓解设计。

六、可靠性与合规性

TESD05FB 已通过 IEC 61000-4-2(ESD)、IEC 61000-4-4(EFT)和 IEC 61000-4-5(浪涌)相关测试,适合满足消费类电子与通信设备常见的抗扰度要求。小封装与低漏电特性有助于在便携与低功耗设计中维持可靠性能。

七、封装与订购信息

  • 品牌:Leiditech(雷卯电子)
  • 型号:TESD05FB
  • 封装:SOD-323(适合表面贴装自动化生产)
  • 建议在采购或设计前,向厂商获取完整器件数据手册(含绝对最大额定值、典型钳位曲线、测试条件与推荐 PCB 尺寸),并依据实际应用(尤其高速信号)确认结电容对信号影响。

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