WMSIC Electronic Components

LOWPOWER(微源半导体) LP3321B6F

ModelLP3321B6F
PackageSOT-23-6
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP3321B6F
Type
LOWPOWER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP3321B6F
Electronic Component
1
Package
SOT-23-6
Electronic Component
LEDDriver
Electronic Component
PWM; Analog
Electronic Component
0.046g
Electronic Component
1
Channel Count
1
Features
(OVP); Built-in; (OTP)
Electronic Component
BM0229970644
Operating Temperature
40℃~+85℃
Switching Frequency
1MHz
Electronic Component
Electronic Component
Operating Voltage(DC)
2.5V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP3321B6F 产品概述

一、产品简介

LP3321B6F为微源半导体(LOWPOWER)推出的一款单通道升压型LED驱动器,采用SOT-23-6小型封装,面向便携设备和背光照明等空间受限、要求高效率与可调光方案的应用。芯片工作电压范围为DC 2.5V ~ 5.5V,开关频率固定为1MHz,工作温度范围-40℃ ~ +85℃。支持PWM与模拟调光,内置过温保护(OTP)与过压保护(OVP),适配严苛的工业与消费电子环境。

二、主要特性

  • 输入电压:DC 2.5V ~ 5.5V,适配单节锂电池及5V供电系统。
  • 拓扑结构:升压(BOOST),单通道输出,适合驱动单组或多串LED(视外部元件及电路设计)。
  • 开关频率:1MHz,高频工作有利于减小外围磁、电容尺寸,满足小型化设计需求。
  • 调光方式:PWM数字调光与模拟(电压)调光两种灵活方案。
  • 保护功能:内置过温保护(OTP)与过压保护(OVP),提高整机可靠性。
  • 封装与温度:SOT-23-6封装,工作温度范围-40℃ ~ +85℃。

三、典型应用

  • 手机、平板、智能穿戴等便携设备的白光/背光驱动。
  • 屏幕/按键背光以及指示灯驱动。
  • 小型手电、照明模组以及需要可调亮度的LED方案。

四、引脚与封装(SOT-23-6)

常见引脚安排示例包括:VIN(电源输入)、GND、SW(开关节点)、FB(反馈)、EN(芯片使能)和DIM(PWM调光输入)。具体引脚定义请参阅LP3321B6F数据手册以确认最终引脚排列与功能。

五、典型电路与设计要点

  • 建议使用低DC阻抗的输入/输出电容以稳定环路并降低纹波;输出电容选用低ESR陶瓷电容。
  • 选择高饱和电流、低直流电阻的电感,常见取值在2.2µH~4.7µH范围,需根据负载电流与效率权衡。
  • 整流二极管建议采用快速恢复或肖特基二极管以降低开关损耗与正向压降。
  • PCB布线要尽量缩短SW回路路径,VIN和GND的大电流回路应以地平面保证散热与低噪声。
  • 调光接口(PWM)应保证清晰的逻辑电平边沿以免引入抖动,模拟调光时注意反馈网络的带宽与稳定性。

六、热管理与可靠性

SOT-23-6封装热容有限,连续大电流工况下需评估芯片结温。保持良好散热路径(底层过孔、散热铜箔),并避免长时间在高温、高负载条件下工作。OTP与OVP为二次保护,设计时仍需保证外部元件不会导致异常热失控。

七、产品优势与选型建议

LP3321B6F以高频率、小封装与多种调光方式为优势,适合空间和成本受限的便携与消费类产品。选型时关注所需输出电流、工作效率与外围器件尺寸,结合PCB散热条件与系统热预算,选择匹配电感与二极管以获得最佳性能表现。

欲获取详细电气参数、典型波形和完整引脚定义,请参阅LP3321B6F完整数据手册或联系微源半导体技术支持。

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